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F4BTMS430-2-Layer-PCB-Wangling-3.175mm-Aerospace-Grade-Ceramic-PTFE-Composite-with-Enhanced-Dk-Range-and-Stability |
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1. F4BTMS Introduction
Wangling's F4BTMS series represents a significant technological advancement over previous F4BTM materials, combining precision-engineered nano-ceramic additives with ultra-fine glass fiber reinforcement in a PTFE matrix. This innovative formulation delivers exceptional dielectric stability across an expanded constant range while minimizing wave propagation interference - achieving reduced loss, enhanced dimensional stability, and improved isotropy for superior high-frequency performance.
Designed for mission-critical aerospace applications, these advanced laminates feature standard RTF copper foil for optimal conductor performance and compatibility with both copper/aluminum bases. The material's unique thermal properties - including outstanding CTE characteristics and temperature-stable dielectric behavior - make it the ideal choice for replacing imported solutions in demanding RF environments.
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2. Features （F4BTMS430) |
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- Dielectric constant (Dk) of 4.3 at 10GHz
- Dissipation factor of .0015 at 10GHz, 0.0019 at 20GHz
- CTE x-axis of 13 ppm/°C, CTE y-axis of 12 ppm/°C, CTE z-axis of 47 ppm/°C, -55°C to 288°C
- Low Thermal coefficient of Dk at-60 ppm/°C, -55°C to 150°C
- High Thermal conductivity of 0.63 W/mk
- Low Moisture absorption of 0.08% |
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3. PCB Stack-up: 2-layer Rigid PCB
Copper_layer_1 - 35 μm
F4BTMS430 Core - 3.175 mm (125mil)
Copper_layer_2 - 35 μm
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| 4. PCB Construction details: |
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| - Base material: F4BTMS430
- Layer count: 2 layers
- Board dimensions: 89.59mm x 70.83 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/6 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 3.2mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Hot Air Soldering Level (HASL)
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Black
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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5. PCB Statistics:
Components: 18
Total Pads: 51
Thru Hole Pads: 27
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 31
Nets: 2
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6. Type of artwork supplied: Gerber RS-274-X |
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7. Quality standard: IPC-Class-2 |
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8. Availability: worldwide |
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9. Some Typical Applications:
- Aerospace equipment, space and cabin equipment
- Microwave, RF
- Radar, military radar
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications, and more. |
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NEXT: F4BTMS1000-2-Layer-0.508mm-PCB--Wangling-Ultra-High-Thermal-Conductivity-Microwave-Substrate-for-Phase-Array-Antennas |
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