1. F4BTMS Introduction

The F4BTMS series represents a significant technological evolution from its F4BTM predecessor, featuring an optimized material system combining nano-ceramic additives with precision-engineered glass fiber reinforcement in a PTFE matrix. This innovative formulation delivers superior dielectric stability across an extended Dk range while minimizing wave propagation interference - achieving reduced loss, enhanced dimensional control, and improved thermal/mechanical isotropy for demanding RF applications.

Engineered for mission-critical aerospace systems, these advanced laminates incorporate standard RTF copper foil for optimal conductor performance and compatibility with both copper/aluminum baseplates. The material's unique thermal characteristics - including exceptional CTE properties and temperature-stable dielectric behavior - position it as a competitive alternative to imported high-frequency solutions.

- Dielectric constant (Dk) of 10.2 at 10GHz

- Dissipation factor of .0020 at 10GHz, 0.0023 at 20GHz

- CTE x-axis of 16 ppm/°C, CTE y-axis of 18 ppm/°C, CTE z-axis of 32 ppm/°C, -55°C to 288°C

- Low thermal coefficient of Dk at-320 ppm/°C, -55°C to 150°C - High Thermal conductivity of 0.81 W/mk

- Low Moisture absorption of 0.03%

3. PCB Stack-up: 2-layer Rigid PCB

Copper_layer_1 - 35 μm

F4BTMS1000 Core - 0.508 mm (20mil)

Copper_layer_2 - 35 μm

5. PCB Statistics:

Components: 21
Total Pads: 60
Thru Hole Pads: 33
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 41
Nets: 2