1. Introduction to IT-180

IT-180ATC is an advanced epoxy-based laminate engineered for demanding applications, featuring a high glass transition temperature (Tg 175°C by DSC) for superior thermal reliability. This multifunctional composite material delivers exceptional CAF resistance and withstands lead-free assembly processes up to 260°C, making it ideal for high-density interconnects and thermally challenging environments.

- High Tg (DSC) of 175°C

- Dielectric constant is 4.4 @ 10GHz

- Dissipation factor is 0.015 @10GHz

- Low CTE on X/Y Axis, 11-13 ppm/°C, 13-15 ppm/°C

- High thermal reliability, T266 >60 minutes; T288, 20 minutes

- Excellent CAF resistance / Good through-hole reliability

- Improved z-axis thermal expansion

- Anti-CAF capability

- Lead Free

- UL 94 V0 Flammability

3. PCB Stack-up: 10-layer Rigid PCB (Component side at top)

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    MATERIAL COPPER LAYER THICKNESS(um) SPECIFICATION

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  COPPER      1 45 18um base copper + 17um plating

  IT-180 PP    Prereg   100 IPC-4101/24

  COPPER      2 18

  IT-180     Prepreg 160 IPC-4101/24

  COPPER      3 18

  FR-4 IT-180    CORE 200 IPC-4101/24

  COPPER      4 18

  IT-180 PP Prepreg 160 IPC-4101/24

  COPPER      5 18

  FR-4 IT-180     CORE 200 IPC-4101/24

  COPPER      6 18

  IT-180 PP     Prepreg 160 IPC-4101/24

  COPPER      7 18

  FR-4 IT-180     CORE   100 IPC-4101/24

  COPPER      8 18                

  IT-180 PP     Prepreg 160 IPC-4101/24

  COPPER      9 18

  IT-180 PP     Prepreg   100 IPC-4101/24

  COPPER      10 45 18um base copper + 17um plating

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5. PCB Statistics:

Components: 281
Total Pads: 381
Thru Hole Pads: 145
Top SMT Pads: 140
Bottom SMT Pads: 96
Vias: 3051
Nets: 10