1. Introduction of TLX-8 High volume antenna material

TLX-8 Laminate is a PTFE fiberglass composite material engineered for high-reliability antenna applications across demanding RF environments. This versatile substrate supports diverse microwave designs through its adjustable thickness options and customizable copper cladding configurations.

The material delivers critical mechanical stability in extreme operating conditions, including:

- Vibration-resistant performance for spacecraft-mounted PCBs during launch

- Thermal endurance in engine compartment electronics

- Space-grade radiation hardness (NASA-compliant low outgassing)

- Marine-environment durability for naval antenna systems

- Wide-temperature operation for avionics altimeter circuits

TLX-8's balanced dielectric and structural properties make it particularly effective for low-layer-count microwave designs requiring robust environmental resistance without compromising RF performance.

2. Benefits

- Excellent PIM Values in PCBs (measured at lower than -160 dBc)

- Excellent Mechanical & Thermal Properties

- Low and Stable Dk

- Dimensionally Stable

- Low Moisture Absorption

- Tightly Controlled DK

- Low DF

- UL 94 V0 Rating

- For Low Layer Count Microwave Designs

3. Main Properties

- Electrical Properties

Dielectric Constant @ 10 GHz - 2.55 ± 0.04 - IPC-650 2.5.5.3

Dissipation Factor @ 10 GHz - 0.0018 - IPC-650 2.5.5.5.1

Surface Resistivity Elevated Temp. 6.605 x 10^8 Mohm IPC-650 2.5.17.1 Sec. 5.2.1

Surface Resistivity Humidity Cond. 3.550 x 10^6 Mohm IPC-650 2.5.17.1 Sec. 5.2.1

Volume Resistivity Elevated Temp. 1.110 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1

Volume Resistivity Humidity Cond. 1.046 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1

- Dimensional Stability

MD After Bake 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4

CD After Bake 0.08 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4

MD Thermal Stress 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5

CD Thermal Stress 0.10 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5

- CTE (25-260 °C)

X - 21 ppm/°C - IPC-650 2.4.41/ASTM D 3386

Y - 23 ppm/°C - IPC-650 2.4.41/ASTM D 3386

Z - 215 ppm/°C - IPC-650 2.4.41/ASTM D 3386

- Td

2% Weight Loss - 535 °C - IPC-650 2.4.24.6 (TGA)

5% Weight Loss - 553 °C - IPC-650 2.4.24.6 (TGA)

-Chemical / Physical Properties

Moisture Absorption - 0.02 % IPC-650 2.6.2.1

Dielectric Breakdown - > 45 Kv - IPC-650 2.5.6

Flammability Rating - V-0 - UL-94

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Taconic TLX-8 Core - 0.508 mm (20mil)

Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 128

Total Pads: 187

Thru Hole Pads: 31

Top SMT Pads: 156

Bottom SMT Pads: 0

Vias: 168

Nets: 2