1. Introduction of RO4360G2 PCB

RO4360G2 laminates are high-performance, low-loss RF materials featuring a unique ceramic-filled, glass-reinforced thermoset construction that delivers exceptional electrical properties while maintaining FR-4-like processability. As the first high-Dk thermoset laminate compatible with standard PCB fabrication methods, RO4360G2 PCB offers superior rigidity for enhanced multilayer board processing, lead-free manufacturing compatibility, and significant cost savings versus traditional high-frequency materials. RO4360G2 versatile laminates can be seamlessly combined with RO4400 series prepregs and lower-Dk RO4000 laminates, providing designers with flexible, cost-effective solutions for demanding RF and microwave applications without compromising performance or manufacturability.

2. Features

- Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C

- Dissipation factor of 0.0038 at 10 GHz/23°C

- Td> 407°C, High Tg greater than 280 °C TMA

- High Thermal Conductivity of 0.75 W/mK

- Low Z-axis coefficient of thermal expansion at 28 ppm/°C

- Copper matached Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 13 ppm/°C, Y axis 14 ppm/°C

- Lead free Process Compatible, 94V-0 flammability.

3. Benefits

-Design flexibility

-Plated through-hole reliability

-Automated assembly compatible

-Environmentally friendly- Lead free process compatible

-Efficient supply chain and short lead times reduce overall project costs

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO4360G2 Substrate - 8mil (0.203mm)

Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 18

Total Pads: 57

Thru Hole Pads: 39

Top SMT Pads: 18

Bottom SMT Pads: 0

Vias: 51

Nets: 2