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RTduroid-5880-2-Layer-20mil-Immersion-Gold-PCB-Low-Loss-PTFE-Composite-for-Stripline-and-Microstrip-Circuit-Applications |
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1. Introduction of RT/duroid 5880 PCB
Rogers RT/duroid 5880 High-Frequency Laminates represent the gold standard in PTFE-based microwave substrates, combining precision engineering with exceptional electrical performance. These glass microfiber-reinforced composites deliver unparalleled dielectric constant uniformity across panels and maintain consistent electrical properties throughout a broad frequency spectrum - from RF through Ku-band and beyond. The material's ultra-low dissipation factor ensures minimal signal loss in demanding stripline and microstrip applications, while its unique mechanical properties allow for easy machining and shaping without compromising structural integrity. Engineered for reliability, RT/duroid 5880 PCB exhibits outstanding resistance to all common PCB processing chemicals, solvents, and plating solutions, making it the ideal choice for mission-critical high-frequency designs where performance consistency and manufacturing yield are paramount.
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2. Features
- Dielectric constant of 2.2 with tight tolerance 0.02 at 10 GHz/23°C
- Dissipation factor of 0.0009 at 10GHz
- Temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C
- Low Moisture Absorption 0.02%
- CTE in X-axis of 31 ppm/°C, Y-axis of 48 ppm/°C and Z-axix of 237 ppm/°C
- Isotropic |
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3. Benefits
Exceptional Frequency Stability - Maintains uniform electrical properties across wide frequency ranges
Superior Machinability - Easily cut, sheared and precision-machined for complex designs
Chemical Process Resilience - Withstands all standard etching and plating solutions
Moisture-Resistant Performance - Reliable operation in high-humidity environments
Proven Industry Standard - Trusted, well-established material with decades of successful applications
Best-in-Class Low Loss - Lowest electrical loss characteristics among reinforced PTFE materials |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
RT/duroid 5880 - 0.508 mm (20mil)
Copper_layer_2 - 35 μm |
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| 5. PCB Construction Details: |
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| - Base material: RT/duroid 5880
- Layer count: 2 layers
- Board dimensions: 60mm x 55 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Electroless Nickel Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 18
Total Pads: 39
Thru Hole Pads: 23
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 33
Nets: 2
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Typical Applications:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point to Point Digital Radio Antennas
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NEXT: RTduroid-6002-2-Layer-5mil-PCB-Advanced-Low-Loss-Microwave-Substrate-for-Complex-RF-Structures-and-Multilayer-Constructions |
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