1. Introduction of RT/duroid 6002

Rogers RT/duroid 6002 High-Frequency PCBs are advanced ceramic-reinforced PTFE composites engineered for precision microwave applications. These low-dielectric-constant materials deliver exceptional high-frequency performance with minimal signal loss, while their optimized mechanical properties ensure reliable integration in complex multilayer board architectures. The unique material formulation provides outstanding electrical stability across microwave and millimeter-wave frequencies, making these laminates ideal for demanding RF designs in aerospace, telecommunications, and defense systems where consistent performance and signal integrity are critical.

2. Features

- Dielectric constant (Dk) of 2.94 +/- .04

- Low thermal coefficient of Dk at 12 ppm/°C

- Dissipation factor of .0012 at 10GHz

- Td 500 °C TGA

- Thermal Conductivity of 0.6 W/m/k

- Low Z-axis coefficient of thermal expansion at 24 ppm/°C

- Moisture Absorption of 0.02%

3. Benefits

- Low loss ensures excellent high-frequency performance;

- Tight thickness control maintains precision in manufacturing;

- In-plane expansion coefficient matched to copper suits applications sensitive to temperature changes;

- Low out-gassing makes it ideal for space applications;

- Excellent dimensional stability guarantees consistent performance;

- Superior mechanical and electrical properties enable reliable multi-layer board constructions.

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RT/duroid 6002 Substrate - 5mil (0.127mm)

Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 72

Total Pads: 313

Thru Hole Pads: 215

Top SMT Pads: 98

Bottom SMT Pads: 0

Vias: 171

Nets: 2