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Rogers RO4350B High-frequency Laminate 0.338 mm 13.3mil Immersion Gold Circuit Board |
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1. Introduction of RO4350B
Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics, offering electrical performance similar to PTFE/woven glass while maintaining the manufacturability of epoxy/glass.
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These laminates ensure tight control over dielectric constant (Dk) and low loss using standard epoxy/glass processing methods. Available at a fraction of the cost of traditional microwave laminates, RO4350B does not require special through-hole treatments like PTFE-based materials. They are UL 94 V-0 rated for active devices and high-power RF designs. |
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The thermal coefficient of expansion (CTE) of RO4350B closely matches that of copper, providing excellent dimensional stability essential for mixed-dielectric multilayer boards. Its low Z-axis CTE ensures reliable plated through-hole quality, even under severe thermal shock. With a Tg exceeding 280°C (536°F), RO4350B maintains stable expansion characteristics across the circuit processing temperature range. |
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2. Features
- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C
- Dissipation Factor of 0.0037 at 10GHz/23°C
- Thermal Conductivity 0.69 W/m/°K
- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C
- High Tg value of >280 °C
- Low water absorption of 0.06%
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3. Benefits
-Perfect for multi-layer board (MLB) constructions
-Processes similar to FR-4 at reduced fabrication costs
-Outstanding dimensional stability
-Cost-effective |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers RO4350B Core - 0.338 mm (13.3mil)
Copper_layer_2 - 35 μm
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5. PCB Construction Details: |
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- Board dimensions: 40 mm x 40 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/6 mils
- Minimum Hole Size: 0.2mm
- No Blind vias.
- Finished board thickness: 0.5mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 10
Total Pads: 29
Thru Hole Pads: 19
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 21
Nets: 1 |
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- Antennas and power amplifiers for cellular base stations
- RF identification devices
- Radar and sensor systems for automotive applications
- LNB converters for direct broadcast satellites |
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NEXT:RO4535 PCB 20mil Rogers 2-layer Substrates High Frequency Laminate for Microstrip Antennas |
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