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RTduroid 5880 PCB 2-layer 10mil Copper Filled Via for Exacting Stripline and Microstrip Circuit Applications

Shipped: 13th-JAN-2025

1. Introduction of RT/duroid 5880

Rogers RT/duroid 5880 high - frequency laminates are crafted as PTFE composites strengthened by glass microfibers. Engineered specifically for the most demanding stripline and microstrip circuit applications, these laminates offer a distinct advantage. Thanks to the randomly arranged microfibers, they achieve an outstanding level of dielectric constant uniformity.


 
Not only is the dielectric constant of RT/duroid 5880 laminates consistent from one panel to another, but it also remains stable across a broad frequency spectrum. Moreover, its impressively low dissipation factor expands the applicability of RT/duroid 5880 laminates well into the Ku - band and even higher frequency ranges. This makes it an ideal choice for high - performance, frequency - sensitive electronic projects.
 

2. Features

- Dielectric constant of 2.2 with tight tolerance 0.02 at 10 GHz/23°C

- Dissipation factor of 0.0009 at 10GHz

- Temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C

- Low Moisture Absorption 0.02%

- CTE in X-axis of 31 ppm/°C, Y-axis of 48 ppm/°C and Z-axix of 237 ppm/°C

- Isotropic

 

3. Benefits

-Consistent electrical performance across a broad frequency spectrum

-Simple to cut, share, and machine into desired shapes

-Highly resistant to solvents and chemicals used in etching or plating edges and holes

-Perfectly suited for high-humidity or moisture-rich environments

-A proven and widely used material

-Offers the lowest electrical loss among reinforced PTFE materials

 

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

RT/duroid 5880 - 0.254 mm (10mil)

Copper_layer_2 - 35 μm

 
5. PCB Construction Details:
 

- Board dimensions: 50mm x 45 mm=1PCS, +/- 0.15mm

- Minimum Trace/Space: 5/4 mils

- Minimum Hole Size: 0.2mm

- No Blind vias.

- Finished board thickness: 0.4mm

- Finished Cu weight: 1oz (1.4 mils) outer layers

- Via plating thickness: 20 μm

- Surface finish: Immersion gold

- Top Silkscreen: White

- Bottom Silkscreen: No

- Top Solder Mask: Matt green

- Bottom Solder Mask: No

- Copper filling vias on designated IC Pad.

- 100% Electrical test used prior to shipment

 
 
 

6. PCB Statistics:
Components: 23

Total Pads: 40

Thru Hole Pads: 21

Top SMT Pads: 19

Bottom SMT Pads: 0

Vias: 42

Nets: 2

 
7. Type of artwork supplied: Gerber RS-274-X
 
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide

10. Some Typical Applications:
- Microstrip and Stripline Circuits

- Millimeter Wave Applications

- Radar Systems

- Guidance Systems

- Point to Point Digital Radio Antennas

 
 
 
 
 
 
NEXT: 2 - Layer, 20mil TLY - 5 PCB: Stable and Low - Loss Solution for Automotive Radar and Millimeter - Wave Applications
 
 
 

 

 
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