1. Introduction of RO3203

The RO3203 PCB is a 4-layer, 0.6mm thick laminate made from ceramic-filled materials reinforced with woven fiberglass. Engineered for exceptional electrical performance and mechanical stability, these high-frequency materials are competitively priced. The RO3203 serves as an extension of the RO3000 Series but features improved mechanical stability. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, the RO3203 materials extend the useful frequency range beyond 40 GHz.

2. Features

- Rogers RO3203 ceramic-filled PTFE composites

- Dielectric constant of 3.02+/- 0.04 at 10 GHz/23°C

- Dissipation factor of 0.0016 at 10 GHz/23°C

- Td> 500°C

- Thermal Conductivity of 0.87 W/mK

- Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 13 ppm/°C, Y axis 13 ppm/°C, Z axis 58 ppm/°C

- Lead free Process Compatible, 94V-0 flammability.

3. Benefits

Woven Glass Reinforcement: Enhances rigidity for easier handling.

Uniform Electrical and Mechanical Performance: Ideal for complex multilayer high-frequency structures.

Low Dielectric Loss: Supports high-frequency applications exceeding 20 GHz.

Low In-Plane Expansion Coefficient (Matched to Copper):

-Suitable for epoxy multilayer board hybrid designs.

-Reliable Surface-Mounted Assemblies: Ensures dependable performance in assembly applications.

Excellent Dimensional Stability: Ensures consistent performance.

High Production Yields: Maximizes efficiency in manufacturing.

Economically Priced: Offers cost-effective solutions for volume production.

Surface Smoothness: Facilitates finer line etching tolerances.

4. PCB Stackup: 4-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO3203 Substrate - 10mil (0.254mm)

Copper_layer_2 - 35 μm

- - - - Prepreg FR-28

Copper_layer_1 - 35 μm

Rogers RO3203 Substrate - 10mil (0.254mm)

Copper_layer_2 - 35 μm

6. PCB Statistics:
Components: 10

Total Pads: 20

Thru Hole Pads: 10

Top SMT Pads: 10

Bottom SMT Pads: 0

Vias: 15

Nets: 4