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4-Layer RO4003C Multilayer PCB, 4.8mm Thick: Low-Loss, Cost-Effective for High-Frequency RF Microwave Applications |
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1. Introduction of RO4003C
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This design aims to deliver superior high-frequency performance while enabling low-cost circuit fabrication. The result is a low-loss material that can be processed using standard epoxy/glass (FR-4) methods at competitive prices.
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RO4003C provides essential properties for RF microwave circuit designers, including controlled impedance transmission lines and matching networks. Its low dielectric loss allows for use in various applications where higher operating frequencies restrict the use of conventional circuit board laminates. |
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Available in multiple configurations, RO4003C laminates feature both 1080 and 1674 glass fabric styles, all meeting the same electrical performance specifications. Notably, RO4003C materials are non-brominated and do not hold UL 94 V-0 rating. |
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2. Feastures (RO4003C):
- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz
- Dissipation Factor of 0.0027 at 10GHz
- Thermal Conductivity of 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant at +40 ppm/°C，ranging -50°C to 150°C
- CTE matched to copper with X axis of 11ppm/°C, Y of 14ppm/°C
- Low Z-axis coefficient of thermal expansion at 46 ppm/°C
- Tg >280 °C
- Low Moisture Absorption of 0.06%
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3. PCB Stackup: 4-layer rigid PCB
Copper_layer_1 - 35 μm
RO4003C - 0.508 mm (20mil)
------------------------------------------Prepreg - RO4450F 0.203mm (8mil)
RO4003C - 1.524 mm (60mil)
Copper_layer_2 - 35 μm
------------------------------------------Prepreg - RO4450F 0.203mm (8mil)
RO4003C - 1.524 mm (60mil)
Copper_layer_3 - 35 μm
------------------------------------------Prepreg - RO4450F 0.203mm (8mil)
RO4003C - 0.508 mm (20mil)
Copper_layer_4 - 35 μm |
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4. PCB Construction Details:
- Board dimensions: 65mm x 65mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/8 mils
- Minimum Hole Size: 0.5mm
- No Blind vias.
- Finished board thickness: 4.8mm
- Finished Cu weight: 1oz (1.4 mils) inner/outer layers
- Via plating thickness: 20 μm
- Surface finish: ENEPIG
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- Countersunk holes
- 100% Electrical test used prior to shipment
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5. PCB Statistics:
Components: 6
Total Pads: 11
Thru Hole Pads: 5
Top SMT Pads: 6
Bottom SMT Pads: 0
Vias: 5
Nets: 4
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6. Type of artwork supplied: Gerber RS-274-X |
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7. Quality standard: IPC-Class-2 |
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8. Availability: worldwide |
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9. Some Typical Applications:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point to Point Digital Radio Antennas |
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NEXT: RO4350B 4 - layer 1.8mm PCB: PTFE - level Electric Performance, Easy Processing, the King of Cost - effectiveness |
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