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RO4350B 4 - layer 1.8mm PCB: PTFE - level Electric Performance, Easy Processing, the King of Cost - effectiveness |
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1. Introduction of RO4350B
Rogers RO4350B is a proprietary laminate made from woven glass reinforced hydrocarbon and ceramics, offering electrical performance that rivals PTFE/woven glass while leveraging the manufacturability of epoxy/glass. These laminates provide precise control over the dielectric constant (Dk) and maintain low loss using standard epoxy/glass processing techniques. They are significantly more cost-effective than traditional microwave laminates and do not require the specialized through-hole treatments or handling procedures associated with PTFE materials. Additionally, RO4350B laminates are UL 94 V-0 rated, making them suitable for high-power RF designs and active devices.
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One of the key advantages of RO4350B is its thermal coefficient of expansion (CTE), which closely matches that of copper. This similarity ensures excellent dimensional stability, crucial for mixed dielectric multi-layer board constructions. The laminate's low Z-axis CTE guarantees reliable plated through-hole quality, even under severe thermal shock conditions. With a glass transition temperature (Tg) exceeding 280°C (536°F), the expansion characteristics of RO4350B remain stable throughout the entire range of circuit processing temperatures. |
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2. Features
- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C
- Dissipation Factor of 0.0037 at 10GHz/23°C
- Thermal Conductivity 0.69 W/m/°K
- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C
- High Tg value of >280 °C
- Low water absorption of 0.06%
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3. Benefits
Perfect for multi-layer board (MLB) constructions
Processes similarly to FR-4 at a lower fabrication cost
Superior dimensional stability
Attractively priced in comparison to alternatives |
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4. PCB Stackup: 4-layer rigid PCB
Copper_layer_1 - 35 μm
-------------------------------------Rogers RO4350B Core - 0.762 mm (30mil)
Copper_layer_2 - 35 μm
-------------------------------------Prepreg - RO4450F 0.102mm (4mil)
Copper_layer_3 - 35 μm
-------------------------------------Rogers RO4350B Core - 0.762 mm (30mil)
Copper_layer_4 - 35 μm
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| 5. PCB Construction Details: |
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| - Board dimensions, Stepped 4-layer RF PCB: Outline 1 of 70 mm x 50 mm=1PCS, outline 2 of 70mm x 40mm +/- 0.15mm
- Minimum Trace/Space: 4/7 mils
- Minimum Hole Size: 0.3mm
- Stepped Outline
- Finished board thickness: 0.5mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 9
Total Pads: 32
Thru Hole Pads: 17
Top SMT Pads: 15
Bottom SMT Pads: 0
Vias: 23
Nets: 4 |
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites |
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NEXT: RO4830 2-Layer 9.4mil PCB, Crafted with FR-4 Process, the New Favorite for Millimeter-Wave Applications |
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