1. Introduction of RO3035 PCB

Rogers RO3035 laminates are ceramic-filled, PTFE-based high-frequency circuit materials designed for demanding RF and microwave applications. Part of the RO3000 series, these materials offer consistent mechanical properties across varying dielectric constants (Dk), allowing engineers to create reliable multi-layer board designs without compromising on warpage or structural integrity. Featuring a stable dielectric constant over wide temperature ranges, RO3035 PCBs deliver proven performance in 5G infrastructure, sub-6GHz millimeter wave systems, and massive MIMO applications—ensuring design flexibility and repeatable results for high-frequency circuits.

2. Features

- Rogers RO3003 ceramic-filled PTFE composites

- Dielectric constant of 3+/- 0.04 at 10 GHz/23°C

- Dissipation factor of 0.001 at 10 GHz/23°C

- Td> 500°C

- Thermal Conductivity of 0.5 W/mK

- Moisture Absorption of 0.04%

- Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C

3. Benefits

– Ultra-Low Dielectric Loss

Supports high-performance applications up to 77GHz, ensuring minimal signal degradation.

– Superior Thermal and Mechanical Stability

Maintains reliability across temperature variations, enabling robust stripline and multilayer PCB constructions.

– Uniform Dielectric Properties

Optimized for multi-layer board designs requiring diverse dielectric constants.

Compatible with hybrid architectures integrating epoxy glass multi-layer boards.

– Exceptional Dk Stability

Consistent performance across temperature and frequency, ideal for precision RF components like bandpass filters, patch antennas, and VCOs.

– Low CTE (Matched to Copper)

Enhances reliability in surface-mounted component assemblies.

Optimized for temperature-sensitive applications requiring consistent performance.

Delivers exceptional dimensional stability across operational temperature ranges.

– Cost-Effective Volume Production

Delivers high-frequency performance at competitive laminate pricing, ideal for scalable RF and microwave designs.

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO3003 Substrate - 5mil (0.127mm)

Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 21

Total Pads: 63

Thru Hole Pads: 37

Top SMT Pads: 26

Bottom SMT Pads: 0

Vias: 51

Nets: 2