1. Introduction of RO3006 PCB

Rogers RO3006 High-Frequency PCBs represent a premium ceramic-PTFE composite solution engineered for demanding RF and microwave applications. These advanced materials deliver unmatched electrical and mechanical stability, maintaining a consistent dielectric constant (Dk) across wide temperature ranges. Unlike conventional PTFE glass materials that exhibit Dk variations near room temperature, RO3006 laminates provide exceptional stability - ensuring reliable performance in critical communication systems, radar applications, and high-frequency circuits where signal integrity is paramount. The material's superior thermal and electrical characteristics make it ideal for next-generation wireless infrastructure and aerospace/defense applications requiring precision and durability.

2. Features

- Rogers RO3006 ceramic-filled PTFE composites

- Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C

- Dissipation factor of 0.002 at 10 GHz/23°C

- Td> 500°C

- Thermal Conductivity of 0.79 W/mK

- Moisture Absorption of 0.02%

- Coefficient of Thermal Expansion (-55 to 288 °C)：X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C

3. Benefits

- Consistent mechanical properties across dielectric constants

Optimized for multi-layer board designs with diverse dielectric values.

Compatible with hybrid architectures using epoxy glass multi-layer boards.

- Low in-plane thermal expansion (matched to copper)

Enhances reliability in surface-mounted component assemblies.

Ideal for temperature-sensitive applications requiring stable performance.

Ensures excellent dimensional stability across operational temperatures.

- Scalable volume manufacturing process

Cost-effective laminate pricing for high-volume production.

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Rogers RO3006 - 25mil (0.635mm)

Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 12

Total Pads: 32

Thru Hole Pads: 14

Top SMT Pads: 18

Bottom SMT Pads: 0

Vias: 21

Nets: 2