3. Benefits
– Ultra-Low Dielectric Loss
Supports high-performance applications up to 77GHz, ensuring minimal signal degradation.
– Superior Thermal and Mechanical Stability
Maintains reliability across temperature variations, enabling robust stripline and multilayer PCB constructions.
– Uniform Dielectric Properties
Optimized for multi-layer board designs requiring diverse dielectric constants.
Compatible with hybrid architectures integrating epoxy glass multi-layer boards.
– Exceptional Dk Stability
Consistent performance across temperature and frequency, ideal for precision RF components like bandpass filters, patch antennas, and VCOs.
– Low CTE (Matched to Copper)
Enhances reliability in surface-mounted component assemblies.
Optimized for temperature-sensitive applications requiring consistent performance.
Delivers exceptional dimensional stability across operational temperature ranges.
– Cost-Effective Volume Production
Delivers high-frequency performance at competitive laminate pricing, ideal for scalable RF and microwave designs. |
