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Discover RF-10 PCB: 2-Layer 125mil Laminates for Optimal Performance and Reliability in RF Applications |
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1. Introduction of RF-10
RF-10 copper clad laminates are advanced composites made from ceramic-filled PTFE and woven fiberglass. They offer a high dielectric constant and low dissipation factor, making them ideal for RF applications. The incorporation of thin woven fiberglass reinforcement enhances rigidity while minimizing dielectric loss, facilitating easier handling and improved dimensional stability for multilayer circuits.
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Designed for cost-effectiveness and reliable delivery times, RF-10 laminates meet the demands of RF applications that require size reduction. They bond effectively with smooth, low-profile copper, resulting in optimal insertion losses at higher frequencies where skin effect losses are significant. |
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2. Features
- Dielectric Constant of 10.2 ± 0.3 at 10GHz
- Dissipation Factor of 0.0025 at 10GHz
- High Thermal Conductivity of 0.85 W/mk (Unclad)
- x CTE of 16 ppm/°C, y CTE of 20 ppm/°C, z CTE of 25 ppm/°C
- Low Moisture Absorption of 0.08%
- Flammability Rating of V-0
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3. Benefits
- High dielectric constant for reduced RF circuit size
- Superior dimensional stability
- Tight DK tolerance (10.2 ± 0.3)
- Enhanced thermal conductivity for improved thermal management
- Strong adhesion to smooth copper surfaces
- Minimal expansion in X, Y, and Z directions
- Outstanding price-to-performance ratio |
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4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35μm (1oz)
RF-10 Core - 125mil (3.175mm)
Copper_layer_2 - 35μm (1oz)
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| 5. PCB Construction Details: |
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| - Board dimensions: 45mm x 70mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.5mm
- No Blind vias.
- Finished board thickness: 3.2mm
- Finished Cu weight: 2oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Black
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment |
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6. PCB Statistics:
Components: 12
Total Pads: 20
Thru Hole Pads: 11
Top SMT Pads: 9
Bottom SMT Pads: 0
Vias: 16
Nets: 2 |
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7. Type of artwork supplied: Gerber RS-274-X |
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8. Quality standard: IPC-Class-2 |
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9. Availability: worldwide |
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10. Some Typical Applications:
- Microstrip Patch Antennas
- GPS Antennas
- Passive Components (filters, couplers, power dividers)
- Aircraft Collision Avoidance Systems
- Satellite components |
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NEXT: RO3203 4-Layer, 0.6mm Thick High Frequency PCB: Ceramic-Filled, Unmatched Electrical & Mechanical Perfection |
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