1. Introduction to RO4003C

Rogers RO4003C is a proprietary woven glass-reinforced hydrocarbon/ceramic material that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. It is designed to deliver excellent high-frequency performance while ensuring cost-effective circuit fabrication. This results in a low-loss material that can be produced using standard epoxy/glass (FR-4) processes, all at competitive prices.

RO4003C possesses the essential properties required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss enables the use of RO4003C in applications where higher operating frequencies would typically restrict the use of conventional circuit board laminates.

Available in various configurations, RO4003C laminates feature both 1080 and 1674 glass fabric styles, with all configurations adhering to the same electrical performance specifications. It's important to note that RO4003C materials are non-brominated and do not carry a UL 94 V-0 rating.

2. Feastures (RO4003C)

- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz

- Dissipation Factor of 0.0027 at 10GHz

- Thermal Conductivity of 0.71 W/m/°K

- Thermal Coefficient of Dielectric Constant at +40 ppm/°C，ranging -50°C to 150°C

- CTE matched to copper with X axis of 11ppm/°C, Y of 14ppm/°C

- Low Z-axis coefficient of thermal expansion at 46 ppm/°C

- Tg >280 °C

- Low Moisture Absorption of 0.06%

3. Features (S1000-2M)

Low Z-axis CTE: 2.4 ppm/℃, providing excellent through-hole reliability.

High Tg: 185 ℃, ensuring high heat resistance for lead-free FR-4 applications.

Low Water Absorption: 0.08%, offering strong humidity resistance.

Thermal Performance: T260 of 60 minutes and T288 of 30 minutes.

Flammability Rating: UL 94-V0 certified.

4. Basic PCB Specifications

Board type: 8 layers

Material type: RO4003C + FR-4 Tg170 'C

Solder mask: Both sides, Green

Silkscreen print: Top side, white

Surface finish: ENIG

Total board thickness: 1.5mm +/- 10%

Board size: 87.5mm x 40.6mm=1 PCS

Minimum hole size: 0.2mm

Solder mask thickness: 10um

Minimum dielectric thickness: 100um

Minimum trace line width: 115um

Minimum spacing: 135um

Blind via: yes, L1-L2, L7-L8

Buried via: yes, L2-L7

Back drilled via: yes, L1-L6

Impedance controlled:

50 ohm, differential pairs, Top layer, 4mil / 4 mil trace/gap, reference layer 2

100 ohm, differential paris, top layer, 5mil / 6 mil trace/gap, reference layer 2

50 ohm, single end, top layer, 6 mil trace, reference layer 2

All 0.3mm vias are filled and capped in accordance with IPC 4761 Type VII. Edge plating is mandatory.

Components: 41

Total Pads: 73

Thru Hole Pads: 35

Top SMT Pads: 26

Bottom SMT Pads: 12

Vias: 57

Nets: 6