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6-Layer 1.1mm RO4003C S1000-2M Hybrid PCB, Comparable to PTFE, with Lower-Loss and More Favorable Cost

Shipped: 17th-JAN-2025

1. Introduction of RO4003C

Rogers RO4003C, a woven glass - reinforced hydrocarbon/ceramic material, marries the electrical prowess of PTFE with the ease - of - manufacturing of epoxy/glass. This material delivers outstanding high - frequency performance and low - loss traits, rendering it perfect for applications like RF microwave circuits, matching networks, and controlled impedance transmission lines. Presented in multiple configurations featuring 1080 and 1674 glass fabric styles, every variant adheres to the identical electrical performance standards. Available in various configurations, RO4003C laminates use 1080 and 1674 glass fabrics, all meeting the same electrical specifications. RO4003C materials are non - brominated and non - UL 94 V - 0 rated.


 
2.1 Feastures (RO4003C)

- Dielectric Constant of DK 3.38 +/-0.05 at 10GHz

- Dissipation Factor of 0.0027 at 10GHz

- Thermal Conductivity of 0.71 W/m/°K

- Thermal Coefficient of Dielectric Constant at +40 ppm/°C,ranging -50°C to 150°C

- CTE matched to copper with X axis of 11ppm/°C, Y of 14ppm/°C

- Low Z-axis coefficient of thermal expansion at 46 ppm/°C

- Tg >280 °C

- Low Moisture Absorption of 0.06%

 

2.2 Features (S1000-2M)

Lower Z-Axis CTE: Enhances through-hole reliability.

Superior Mechanical Processability: Offers excellent thermal resistance.

Lead-Free Compatibility: Suitable for lead-free applications.

Tg of 180℃ (DSC): UV blocking and AOI compatible.

High Heat Resistance: Withstands elevated temperatures.

Excellent Anti-CAF Performance: Reduces conductive anodic filament issues.

Low Water Absorption: Minimizes moisture retention.

 

3. PCB Stackup: 6-layer rigid PCB

Copper_layer_1 - 35 μm

RO4003C - 0.305 mm (12mil)

Copper_layer_2 - 35 μm Prepreg - 1080 RC63% 0.0644mm (2.5mil)

Copper_layer_3 - 35 μm

S1000-2M - 0.203 mm (3mil)

Copper_layer_4 - 35 μm Prepreg - 1080 RC63% 0.0644mm (2.5mil)

Copper_layer_3 - 35 μm

RO4003C - 0.305 mm (12mil)

Copper_layer_4 - 35 μm

 
4. PCB Construction Details:
 

- Board dimensions: 62.5mm x 57.8mm=1PCS, +/- 0.15mm

- Minimum Trace/Space: 4/7 mils

- Minimum Hole Size: 0.3mm

- No Blind vias.

- Finished board thickness: 1.1mm

- Finished Cu weight: 1oz (1.4 mils) inner/outer layers

- Via plating thickness: 20 μm

- Surface finish: Immersion Silver

- Top Silkscreen: White

- Bottom Silkscreen: No

- Top Solder Mask: Matt Blue

- Bottom Solder Mask: Matt Blue

- Impedance control on 4mil / 7mil traces/gaps top layer, 90 ohm

- Print series number

- 0.3mm via filled and capped

- 100% Electrical test used prior to shipment

 
 

5. PCB Statistics:

Components: 22

Total Pads: 39

Thru Hole Pads: 21

Top SMT Pads: 18

Bottom SMT Pads: 0

Vias: 21

Nets: 5


 
6. Type of artwork supplied: Gerber RS-274-X
 
7. Quality standard: IPC-Class-2
 
8. Availability: worldwide

9. Some Typical Applications:
- Commercial Airline Broadband Antennas

- Microstrip and Stripline Circuits

- Millimeter Wave Applications

- Radar Systems

- Guidance Systems

- Point to Point Digital Radio Antennas

 
 
 
 
 
 
NEXT: 31mil Rogers IsoClad 933 Two-layer PCB, the Perfect Choice for Excellent Conformability and Super Stability
 
 
 

 

 
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