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6-Layer 370HR PCB 1.03mm ENIG High Temperature FR-4 with 180°C Tg for Demanding Multilayer Applications

Shipped: 28th-APR-2025

1. Introduction of 370HR

Isola 370HR PCB represents a premium-grade FR-4 solution engineered for multilayer PCB designs requiring exceptional thermal reliability. This high-performance material system features a 180°C glass transition temperature (Tg), developed with specialized multifunctional epoxy resin and E-glass reinforcement to deliver superior thermal characteristics while maintaining standard FR-4 processing compatibility.

 

The 370HR series outperforms conventional FR-4 materials with enhanced thermal stability, reduced expansion rates, and improved mechanical properties. 370HR PCBs advanced formulation provides excellent chemical resistance and moisture protection while incorporating laser fluorescing and UV-blocking capabilities for optimal compatibility with modern manufacturing processes including AOI systems and photoimageable solder mask applications.

 

Particularly effective in sequential lamination scenarios, 370HR laminate has established itself as an industry-leading solution for complex multilayer constructions. The  370HR material's balanced performance characteristics make it ideal for applications where thermal endurance, dimensional stability, and manufacturing efficiency are critical requirements.


2. Features of 370HR

- High Thermal Performance

- Tg: 180°C (DSC)

- Td: 340°C (TGA @ 5% wt loss)

- Low X/Y-Axis CTE of 13/14ppm/°C for reliability

- T260: 60 minutes

- T288: 30 minutes

- RoHS Compliant

- UV Blocking and AOI Fluorescence

- High throughput and accuracy during PCB fabrication and assembly

- CAF Resistant

- Superior Processing: Closest to conventional FR-4 processing

 

3. Impedance matching, +/- 10%. :

   Layer 1, 10mil single end, 50 ohm, reference layer 2

   Layer 3, 6mil single end, 50 ohm, reference layer 2

   Layer 4, 6mil single end, 50 ohm, reference layer 5

   Layer 6, 10mil single end, 50 ohm, reference layer 5

 

4. PCB Stackup: 6-layer rigid PCB

TOP SILK LAYER

TOP MASK LAYER

TOP LAYER (PCB Layer 1) - 1.4mil (1oz)

IS370 HR - 6mil

GROUND PLANE (PCB Layer 2)    -1.4mil (1oz)

IS370 HR - 6mil

MID LAYER 1 (PCB Layer 3) - 1.4mil (1oz)

IS370 HR -8mil

MID LAYER 2 (PCB Layer 4) -1.4mil (1oz)

IS370HR - 6mil

POWER PLANE (PCB Layer 5) -1.4mil (1oz)

IS370HR - 6mil

BOT LAYER (PCB Layer 6) -1.4mil (1oz)

BOT MASK LAYER

BOT SILK LAYER

 
5. PCB Construction Details:
 

    - Base material: 370HR

    - Layer count: 6-layer

    - Board dimensions:  102.87mm x 128.5 mm/4up,   +/- 0.15mm

    - Minimum Trace/Space:  4/4 mils

    - Minimum Hole Size:  8 mils

    - No blind or buried vias, no slotted holes

    - Finished Cu weight:  1 oz signal and plane layers  

    - Top/Bottom Silkscreen:   White

    - Top/Bottom Solder Mask:  Green

    - Board thickness:  40.4 mils / 1.02mm +/- 0.05mm

    - All edges tab-routed, non-plated holes for breakouts

    - UL mark on PCB required

    - Electrical test required

    - Ensure no silkscreen on solder pads

    - Panel breakouts required

    - Surface Finish:  ENIG, with 0.1um (0.004 mils) gold, for -40°C to +85°C

 

 

6. PCB Statistics:

    Components:         120

    Total Pads:         267

    Thru Hole Pads:     37

    Top SMT Pads:       218

    Bottom SMT Pads:    12

    Vias:               198

    Nets:               58

 
7. Type of artwork supplied: Gerber RS-274-X
 
8. Quality standard: IPC-Class-2
 
9. Availability: worldwide

10. Typical Applications:

- Computing, Storage & Peripherals

- Networking & Communications

- Automotive & Transportation

- Consumer Electronics

- Aerospace & Defense

- Medical, Industrial & Instrumentation

 
 
 
 
 
 
NEXT: Wangling F4BM220 2-Layer 0.8mm Thick Immersion Gold PCB with Enhanced Dielectric Stability for RF Applications
 
 
 

 

 
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