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10mil-RO4350B-and-S1000-2M-4-Layer-1.6mm-Hybrid-PCB: Low-Cost-RF-Solution-with-Superior-Signal-Integrity |
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1. RO4350B Introduction
Rogers RO4350B is a proprietary woven glass-reinforced hydrocarbon/ceramic material that delivers electrical performance comparable to PTFE/woven glass, combined with the manufacturability of standard epoxy/glass. This unique blend makes it an ideal choice for high-frequency and high-power RF designs. |
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RO4350B laminates offer tight control over dielectric constant (Dk) and low signal loss, while maintaining compatibility with standard epoxy/glass processing methods. Unlike traditional PTFE-based materials, RO4350B eliminates the need for special through-hole treatments or handling procedures, significantly reducing production costs. Additionally, it is UL 94 V-0 rated, ensuring safety and reliability for active devices and high-power RF applications. |
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With a thermal coefficient of expansion (CTE) closely matched to copper, RO4350B provides excellent dimensional stability, making it perfect for mixed-dielectric multilayer board constructions. Its low Z-axis CTE ensures reliable plated through-hole quality, even under extreme thermal shock conditions. Furthermore, RO4350B boasts a Tg of >280°C (536°F), ensuring stable expansion characteristics across the entire range of circuit processing temperatures. |
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Choose Rogers RO4350B for a cost-effective, high-performance solution that bridges the gap between advanced RF performance and manufacturability. Perfect for aerospace, telecommunications, and high-power RF designs, RO4350B sets the standard for reliability and efficiency. |
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2.1 Key Features of (RO4350B):
- Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C
- Dissipation Factor of 0.0037 at 10GHz/23°C
- Thermal Conductivity 0.69 W/m/°K
- X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C
- High Tg value of >280 °C
- Low water absorption of 0.06%
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2.2 Key Features of (S1000-2M):
-Lower Z-Axis CTE for improved throughhole reliability
-Excellent Mechanical Processability andThermal Resistance
-Leadfree Compatible
-Tg180℃ (DSC), UV Blocking/AOI compatible
-High heat resistance
-Excellent Anti-CAF performance
-Low water absorption |
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3. PCB Stackup: 4-layer rigid PCB
Copper_layer_1 - 35 μm
RO4350B - 0.254 mm (10mil)
Copper_layer_2 - 35 μm
-------------------------------------------Prepreg - 1080 RC63% 0.0644mm (2.5mil)
Copper_layer_3 - 35 μm
S1000-2M - 1.1 mm (43mil)
Copper_layer_4 - 35 μm |
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| 4. PCB Construction Details: |
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| - Board dimensions: 90mm x 95mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/4 mils
- Minimum Hole Size: 0.35mm
- No Blind vias.
- Finished board thickness: 1.6mm
- Finished Cu weight: 1oz (1.4 mils) inner/outer layers
- Via plating thickness: 20 μm
- Surface finish: Electroless Nickle Immersion Gold (ENIG)
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: No
- Impedance control on 5mil / 9mil traces/gaps, top layer, 50 ohm
- Edge plated for designated area.
- 0.35mm via filled and capped
- 100% Electrical test used prior to shipment |
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5. PCB Statistics:
Components: 33
Total Pads: 242
Thru Hole Pads: 125
Top SMT Pads: 117
Bottom SMT Pads: 0
Vias: 49
Nets: 3
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6. Type of artwork supplied: Gerber RS-274-X |
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7. Quality standard: IPC-Class-2 |
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8. Availability: worldwide |
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9. Some Typical Applications:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point to Point Digital Radio Antennas |
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NEXT: 16-Layer, 2.0mm-M6-PCB: Optimized-for-5G, HPC, and-High-Speed-Servers-with-Low-Dielectric-Loss-0.002 |
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