Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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What Circuit Boards Do We Do? (9)

RO4003C High Frequency PCB

 

Introduction

Rogers RO4003C materials feature proprietary woven glass reinforced hydrocarbon/ceramics. They offer the electrical performance equivalent to PTFE/woven glass and the manufacturability found in epoxy/glass composites.

 

RO4003C laminates incorporate both 1080 and 1674 glass fabric styles with all configurations, ensuring consistent electrical performance. They excel in maintaining precise control on dielectric constant (Dk) and minimizing signal loss, all while employing the same processing method as standard epoxy/glass laminates. The remarkable aspect is that these laminates achieve such high performance levels at a significantly reduced cost compared to traditional microwave laminates.

 

Features

With a dielectric constant (Dk) of 3.38 +/- 0.05, RO4003C laminates offer exceptional stability and consistency in signal transmission.

 

Additionally, boasting a dissipation factor of 0.0027 at 10 GHz, they ensure minimal signal loss, enabling high-frequency applications to thrive.

 

But that's not all. RO4003C laminates also exhibit a low Z-axis coefficient of thermal expansion, measuring only 46 ppm/°C. The low Z-axis CTE ensures reliable plated through-hole quality, even in severe thermal shock applications.

 

These properties make them ideal for multi-layer board (MLB) constructions. And impressively, these laminates can be processed using the same methods as FR-4, a common and cost-effective material in the industry. This compatibility translates to lower fabrication costs, making RO4003C laminates an economical choice without compromising on performance.

 
 

PCB Capability

Our manufacturing capability covers a range of layer counts, including double layer, multilayer, and hybrid PCBs, allowing you to achieve the desired complexity and functionality for your designs.

 

You have the flexibility to select the copper weight that suits your requirements, with options including 1oz (35µm), and 2oz (70µm), ensuring optimal conductivity and performance.

 

When it comes to RO4003C thickness options, we provide a range of choices to suit your specific requirements. Select from 8mil (0.203mm), 12mil (0.305mm), 16mil (0.406mm), 20mil (0.508mm), 32mil (0.813mm), and 60mil (1.524mm).

 

Rest assured, the maximum PCB size we can manufacture is 400mm X 500mm, accommodating a wide range of project sizes and dimensions.

 

For the solder mask, we offer a variety of options to match your preferences, such as green, black, blue, yellow, red, and more, ensuring both functionality and aesthetic appeal.

 

When it comes to surface finish, we provide multiple options to meet your specific needs, such as bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, and pure gold etc.

 

PCB Capability (RO4003C)

PCB Material:

Glass reinforced hydrocarbon ceramic laminates

Code:

RO4003C

Dielectric constant:

3.38 ±0.05 (process) ; 3.55 (design)

Layer count:

1 Layer, 2 Layer, Multi-layer, Hybrid type (Mixed)

Copper weight:

1oz (35µm), 2oz (70µm)

Laminate thickness:

8mil (0.203mm), 12mil (0.305mm), 20mil (0.508mm), 32mil (0.813mm), 60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.

 

Applications

RO4003C PCBs find widespread application in various industries and technologies, such as cellular base station antennas, power amplifiers, RF identification tags, automotive radar and sensors, as well as LNBs for direct broadcast satellites.

 

Thank you. I’ll see you next time.

 
 
 
 

 

 

 
 
 
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