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What Circuit Boards Do We Do? (51)
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TSM-DS3 High Frequency PCB
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Introduction |
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TSM-DS3 is a dimensionally stable laminate with exceptional low-loss properties. Its thermal stability makes it an industry-leading choice, with a dissipation factor (DF) of 0.0011 at 10 GHz. This laminate offers the reliability and consistency of top-quality fiberglass reinforced epoxies. |
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Features |
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TSM-DS3 stands out as a ceramic-filled reinforced material with a minimal fiberglass content of approximately 5%. This composition allows it to compete with epoxies in the fabrication of complex multilayers, even in large formats. It was specifically developed for high-power applications, where efficient heat dissipation is crucial (thermal conductivity: 0.65 W/m*K). TSM-DS3 effectively conducts heat away from other heat sources in a PCB design. |
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Furthermore, TSM-DS3 exhibits very low coefficients of thermal expansion, making it suitable for demanding thermal cycling requirements. |
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PCB Capability |
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Our capabilities include single-sided, double-sided, multi-layer PCBs, as well as hybrid PCBs. You have the flexibility to choose the appropriate copper weight for your requirements, whether it's 1oz (35μm) or 2oz (70μm). |
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Additionally, we can accommodate various dielectric thicknesses, ranging from 5mil to 90mil, including options such as 10mil, 20mil, 30mil, 60mil and more. |
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ur capabilities extend to dimension sizes up to 400mm X 500mm, ensuring we can handle projects of different scales. To suit your aesthetic and functional preferences, we offer a diverse range of solder mask colors, including green, black, blue, yellow, red, and more. |
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Moreover, we provide various surface finish options including immersion gold, HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold etc. |
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PCB Material: |
Ceramic-filled Woven Fiberglass PTFE Laminates |
Designation: |
TSM-DS3 |
Dielectric constant: |
3 +/-0.05 |
Dissipation factor |
0.0011 |
Layer count: |
Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness |
5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 90mil (2.286mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
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Applications |
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TSM-DS3 PCB covers a multitude of applications, including couplers, phased array antennas, radar manifolds, mmWave antennas, oil drilling, semiconductor, and automated test equipment (ATE) testing. |
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