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What Circuit Boards Do We Do? (19)
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RO4730G3 High Frequency PCB
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Introduction |
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Rogers RO4730G3 antenna grade laminates are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3?dielectric materials provide the necessary mechanical and electrical properties for ideal antenna performance. |
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RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing for designers to optimize cost and performance. |
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Features |
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RO4730G3 features a dielectric constant of 3.0 with a tight tolerance of just ±0.05. This precise and consistent dielectric property ensures optimal signal integrity and predictable impedance control in your circuit designs. |
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Additionally, it delivers exceptional dissipation factors of just 0.0028, enabling efficient signal transmission and minimizing energy losses in the high-frequency designs. |
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RO4730G3 exhibits a remarkably low Z-axis coefficient of thermal expansion (CTE) at just 35.5 ppm/°C. This low CTE helps minimize the risk of delamination and improves the long-term reliability of your circuits, even under demanding thermal conditions. |
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Complementing its low CTE, RO4730G3 also boasts a low temperature coefficient of dielectric constant (TCDk) of just 34 ppm/°C. This exceptional thermal stability ensures your circuit's performance remains consistent, even as temperatures fluctuate. |
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Finally, RO4730G3 features an exceptionally high glass transition temperature (Tg) of greater than 280°C. This high Tg ensures the material can withstand the elevated temperatures encountered during manufacturing and operation, further enhancing the long-term reliability of the circuits. |
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PCB Capability (RO4730G3) |
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Our RO4730G3 PCBs are custom-made to meet a wide range of specifications to suit your project needs. |
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Choose from a variety of layer counts including single layer, double layer, multi-layer, and hybrid configurations. Copper weights available in 1oz (35µm) and 2oz (70µm). |
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The laminate thickness options include LoPro Copper at 5.7mil to 60.7mil and ED Copper at 20mil to 60mil, providing flexibility for diverse applications. |
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Maximum PCB size of 400mm X 500mm ensures compatibility with various designs. Customize your boards with solder mask colors such as green, black, blue, yellow, and red, among others. |
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Select from surface finishes like bare copper, HASL, ENIG, immersion tin, immersion silver, ENEPIG, pure gold, OSP, and more. |
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PCB Capability (RO4730G3) |
PCB Material: |
Hydrocarbon ceramic woven glass |
Designator: |
RO4730G3 |
Dielectric constant: |
3.0 ±0.05 (process); 2.98 (design) |
Layer count: |
1-layer, 2-layer, Multi-layer, Hybrid configuration |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness (LoPro Copper): |
5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) |
Laminate thickness (ED Copper) |
20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion silver, ENEPIG, Pure gold, OSP,etc. |
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Applications |
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The RO4730G3 is typically for the applications of Cellular Base Station Antennas. |
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Thank you. I’ll see you next time. |
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