Introduction

Rogers RO4360G2 laminates are low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing capability. RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4.

These laminates mark a significant advancement in the field as they are not only lead-free process capable, but also provide enhanced rigidity for improved processability in multi-layer board constructions, ultimately reducing material and fabrication costs.

RO4360G2 laminates can be seamlessly combined with RO4400 series prepreg and lower-Dk RO4000 laminate in multi-layer designs, expanding their versatility.

Features

Let's discuss some prominent features of RO4360G2.

It has a high Dk of 6.15 (Design Dk 6.4), allowing designers to reduce circuit dimensions in applications where size and cost are critical.

They boast a low dissipation factor of 0.0038 at 10 GHz, ensuring minimal signal loss and improved signal integrity.

The laminates also demonstrate a high thermal conductivity of 0.75 W/(m-K), effectively dissipating heat and promoting thermal management within the circuitry.

Additionally, their low Z-axis coefficient of thermal expansion of 28 ppm/°C contributes to their reliability and stability, particularly in plated through hole connections.

Finally, the laminates exhibit a high glass transition temperature (Tg) exceeding 280 °C TMA, further enhancing their durability and suitability for demanding environments.

PCB Capability (RO4360G2)

Our facility boasts an extensive range of PCB manufacturing capabilities. We specialize in the production of double layer boards, multi-layer, and Hybrid PCBs, allowing us to cater to a diverse range of circuit complexities and design requirements.

When it comes to copper weight, we offer the flexibility of choosing from 1oz (35µm) and 2oz (70µm) options, enabling you to select the desired level of conductivity that aligns with your specific needs.

For PCB thickness, we provide a range of options, including 8mil (0.203mm), 12mil (0.305mm), 16mil (0.406mm), 20mil (0.508mm), 24mil (0.610mm), 32mil (0.813mm), and 60mil (1.524mm).

In terms of PCB size, our capabilities support dimensions of up to 400mm X 500mm, accommodating various form factors and allowing for larger-scale designs.

To cater to your visual preferences, we offer a diverse selection of solder mask colors, including green, black, blue, yellow, red, and more.

When it comes to surface finish, we provide a range of options such as bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, and more, ensuring you have the freedom to choose the most suitable finish for your requirements.

Applications

RO4360G2 PCBs are commonly utilized in various applications, including but not limited to Base Station Power Amplifiers and Small Cell Transceivers, among others.

Thank you for reading. I’ll see you next time.