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What Circuit Boards Do We Do? (11)
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TMM4 High Frequency PCB
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Introduction |
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Rogers TMM 4 is a thermoset microwave material designed to offer high plated-thru-hole reliability for strip-line and micro-strip applications. It is a composite material that combines the advantageous characteristics of ceramics, hydrocarbons, and thermoset polymers. |
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TMM 4 materials possess robust mechanical and chemical properties, providing many of the benefits found in both ceramic and traditional PTFE laminates. Unlike those materials, TMM 4 laminates do not require specialized production techniques. They are based on thermoset resins, ensuring reliable wire-bonding without the risk of pad lifting or substrate deformation. |
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Features |
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TMM4 laminates offer several key features as follows: |
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It has a dielectric constant of 4.50 +/- .045, providing stable electrical properties for high-frequency applications, and a dissipation factor of .0020 at 10GHz, indicating low signal loss and efficient signal transmission. |
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TMM4 has a thermal coefficient of Dk of 15ppm/°K, ensuring minimal changes in electrical performance with temperature variations. |
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The coefficient of thermal expansion is matched to copper, with values of x = 16 ppm/°K, y = 16 ppm/°K, and z = 21 ppm/°K. This compatibility reduces the risk of stress-related issues during thermal cycling. |
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TMM4 laminates have a high decomposition temperature (Td) of 425 °C TGA, ensuring their stability and reliability under elevated temperature conditions. |
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It exhibits a thermal conductivity of 0.7 W/mk, facilitating efficient heat dissipation in high-power applications. |
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TMM4 shows excellent resistance to moisture-related issues with moisture absorption rates of 0.07% for a thickness of 50mil and 0.18% for a thickness of 125mil. |
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PCB Capability |
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Our PCB manufacturing capability on TMM4 laminates is summarized in the following table. |
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We offer single sided, double sided, multi-layer and hybrid PCBs, providing flexibility to meet different design requirements. |
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We support copper weights of 1oz (35µm) and 2oz (70µm), allowing you to choose the appropriate copper weight for your specific application. |
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We provide a wide range of laminate thickness options to suit your needs, such as 15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), up to 500mil (12.7mm). |
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Our manufacturing capabilities support PCB sizes up to 400mm X 500mm, providing ample space for your designs. |
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We offer a variety of solder mask colors to suit your preferences and requirements, such as green, black, blue, yellow, red, and more. |
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Our surface finish options include bare copper, HASL, ENIG, immersion tin, immersion silver, pure gold (with no nickel under gold), OSP, and ENEPIG etc. |
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PCB Capability (TMM4) |
PCB Material: |
Composite of Ceramic, hydrocarbon and thermoset polymer |
Designator: |
TMM4 |
Dielectric constant: |
4.5 ?±0.045 (process); ??4.7 (design) |
Layer count: |
Single Sided, Double Sided, Multi-layer, Hybrid designs |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, Pure gold (no nickle under gold), OSP, ENEPIG |
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Typical applications |
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TMM4 High-Frequency PCBs are commonly used in various applications including power amplifiers and combiners, filters and couplers, satellite communication systems, Global Positioning Systems (GPS) antennas, patch antennas, and chip testers etc. |
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Thank you for watching. I'll see you next time. |
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