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What Circuit Boards Do We Do? (1)
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F4BM High Frequency PCB
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Brief introduction |
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Wangling’s F4BM high frequency materials are PTFE glass fiber cloth copper clad laminates that combine glass fiber cloth, PTFE resin, and PTFE film through a meticulous manufacturing process. |
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These series laminates offer improved electrical performance compared to F4B due to their wider range of dielectric constants, low dielectric loss, increased insulation resistance, and enhanced stability. Consequently, they can serve as replacements for similar foreign products. |
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F4BM is cladded with forward-rotating ED copper foil, making it suitable for applications without PIM (Passive Intermodulation) concerns. |
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Features |
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You have the flexibility to choose from a range of DK (dielectric constant) options spanning from 2.17 to 3.0. |
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The DF (dissipation factor) falls within the range of 0.001 to 0.0018. |
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There is a wide selection of thickness options to accommodate your specific requirements and the availability of diverse sizes allows for cost savings. |
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All these characteristics make it well-suited for commercial applications, large-scale production, and cost-effectiveness. |
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PCB Capability |
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Our comprehensive PCB manufacturing?capabilities cover a wide range of aspects. |
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We can provide Single Sided, Double Sided, Multilayer, and Hybrid PCBs to meet your specific needs. |
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You have the flexibility to choose from copper weights of 1oz (35µm) and 2oz (70µm) for your PCBs. |
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Additionally, we offer a variety of dielectric thickness options, ranging from 0.8mm to 12.0mm, including specific measurements such as 1.524mm and 1.575mm. |
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Our capabilities extend to PCB sizes up to 400mm X 500mm, ensuring we can accommodate your size requirements. |
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To customize the appearance of your PCBs, we provide a selection of solder mask colors, including Green, Black, Blue, Yellow, Red, and more. |
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Furthermore, we offer multiple surface finish options, such as Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG, and more. |
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PCB Capability (F4BM) |
PCB Material: |
PTFE glass fiber cloth copper clad laminates |
Designation (F4BM ) |
F4BM |
DK (10GHz) |
DF (10 GHz) |
F4BM217 |
2.17±0.04 |
0.0010 |
F4BM220 |
2.20±0.04 |
0.0010 |
F4BM233 |
2.33±0.04 |
0.0011 |
F4BM245 |
2.45±0.05 |
0.0012 |
F4BM255 |
2.55±0.05 |
0.0013 |
F4BM265 |
2.65±0.05 |
0.0013 |
F4BM275 |
2.75±0.05 |
0.0015 |
F4BM294 |
2.94±0.06 |
0.0016 |
F4BM300 |
3.00±0.06 |
0.0017 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness (or overall thickness) |
0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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Applications |
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F4BM PCB finds it’s wide range of applications, such as phase shifter, passive device, power divider, coupler, combiner, feed network, phased array antenna, satellite communications, base station antenna and radar etc. |
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Thank you. I’ll see you next time. |
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