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What is Tensile Modulus in High Frequency PCB? |
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1. Introduction to Tensile Modulus |
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Tensile modulus measures a material's stiffness under tensile stress and reflects its deformation ability. In high-frequency PCBs, it's a crucial parameter for evaluating material performance, influencing the mechanical and electrical performance of the board. It affects PCB durability and determines its performance in high-temperature and high-frequency settings. Therefore, understanding it is vital for ensuring board reliability under extreme conditions. |
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2. Factors Affecting Tensile Modulus |
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Tensile modulus is influenced by several factors, including: |
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2.1Material Composition
Different substrates (such as FR-4, polyimide, etc.) have varying tensile modulus.2.2 Manufacturing Process The PCB manufacturing process (including lamination, drilling, and etching) can affect the final product's tensile modulus.
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2.2 Manufacturing Process
The PCB manufacturing process (including lamination, drilling, and etching) can affect the final product's tensile modulus. |
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2.3 Environmental Conditions
Temperature and humidity significantly impact PCB performance. High temperatures and humid environments can lead to a decline in material performance. |
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2.4 Design Structure
PCB layout affects tensile modulus due to factors influencing stress concentration, load transfer, structural integrity, and deformation. |
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3. Improvement Measures |
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To optimize the tensile modulus of PCBs, engineers can implement the following measures: |
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3.1 Select High-Performance Materials
Use materials with excellent mechanical properties and thermal stability, such as high-frequency ceramic substrates or polyimide materials, to improve the tensile modulus of the PCB. |
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3.2 Improve Manufacturing Processes
Strictly control temperature, pressure, and time during manufacturing to ensure optimal bonding and performance of materials. |
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3.3 Conduct Environmental Testing
Perform environmental adaptability tests during the design phase to ensure that the PCB can maintain stable performance under expected operating conditions. |
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3.4 Optimize Structural Design
Utilize finite element analysis and other tools for structural optimization to ensure that the PCB can effectively distribute stress and minimize deformation during use. |
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4.Taconic RF-35 PCB Superior in Tensile Modulus |
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When discussing the tensile modulus in high-frequency PCBs, Taconic RF-35 series PCBs immediately comes to my mind. Taconic RF-35 not only has a high tensile modulus, but it also meets lead-free process compatibility and 94V-0 flammability standards, ensuring compliance with industry requirements. Next, let's discuss the details of Taconic RF-35 standard type. |
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4.1 Advantages in Material Reinforcement Structure |
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The use of reinforced glass fiber cloth enhances the Tensile Modulus due to the high strength and modulus of glass fibers, allowing RF-35 PCB to resist deformation under tensile stress. |
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- Ceramic Filling and PTFE Coating
The combination of ceramic filling and PTFE-coated glass fibers optimizes the material's internal structure, increasing hardness and rigidity while improving flexibility and corrosion resistance, leading to better stress distribution and anti-tensile performance. |
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4.2 Advantages in Mechanical Properties |
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The Peel Strength (for 1/2 oz. copper) of Taconic RF-35 laminate exceeds 8.0 N/mm, indicating strong interlayer bonding that effectively transfers stress during stretching, preventing interlayer separation. |
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- High Glass Transition Temperature
With a glass transition temperature over 315 °C, RF-35 subbstrate maintains mechanical stability at high temperatures, ensuring the Tensile Modulus remains effective. |
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4.3 Advantages in Dimensional Stability |
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An ultra-low water absorption rate of 0.02 ensures dimensional stability and consistent mechanical performance under varying humidity. |
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The x-y CTE of 19 - 24 ppm/°C minimizes excessive deformation due to thermal expansion, ensuring reliable Tensile Modulus across temperature changes. |
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The following is the comparison of the mechanical properties between Taconic RF-35 PCB and FR-4. |
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Comparison Items |
Taconic RF-35 |
FR-4 |
Tensile Strength |
27,000 N/mm² in the longitudinal direction and 21,000 N/mm² in the cross direction. |
Lower than that of Taconic RF-35 Standard Type. |
Glass Transition Temperature |
Over 315 °C. |
Around 130 °C - 150 °C. |
Dimensional Stability |
With glass fiber cloth, it has good stability. |
Relatively poor. |
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It is obvious that Taconic RF-35 laminate is superior to FR-4 in terms of mechanical properties. |
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5. Typical Applications |
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6. Concluding Remarks |
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Tensile modulus is an invisible advantage in high-frequency PCB design. Mastering this key parameter will lead to more efficient performance and longer service life for your products. |
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Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Feel free to consult and contant at any time !
Visit https://www.bicheng-enterprise.com to learn more.
Unlock its full potential by contacting Vicky at v.xie@bichengpcb.com. |
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