This chart shows the stability of the dissipation factor of CuClad® 217 PCB across different frequencies.This characteristic demonstrates the inherent robustness of Rogers’ laminates across frequency, providing a stable platform for high frequency applications.
Now let us explore CuClad® 217’s characteristics and advantages when using Rolled (rolled copper foil):
4.1 Characteristics
Copper foil thickness specifications: the Rolled copper foil of CuClad® 217 is available in two common specifications, 1 oz (35μm) and ½ oz (18μm), which can meet the requirements of different PCB designs for copper foil thickness. For example, a thicker copper foil can be selected for circuits with high current - carrying capacity requirements.
Surface roughness: For the two thickness specifications, the surface roughness of the Dielectric Side (dielectric surface) is 0.4μm, and that of the Top Side (top surface) is 0.3μm. The relatively low and stable surface roughness is beneficial to improving the bonding force with other material layers and the stability of electrical performance.
4.2 Advantages
Electrical: Low - roughness Rolled copper foil cuts signal transmission loss and impedance fluctuations. In high - freq circuits, its smooth surface reduces scattering and reflection, ensuring integrity. This gives CuClad® 217 an edge in high - speed comms and RF fields.
Mechanical: Produced via multiple rolling, it has a denser structure, better flexibility and ductility. In flexible PCBs needing bending, it endures more cycles without damage, outperforming other foils and extending PCB life.
Reliability: Stable roughness and good properties strengthen the bond between foil and substrate in CuClad® 217, reducing delamination. This boosts PCB reliability, making it ideal for aerospace and automotive electronics. |