Rogers DiClad 870 high frequency PCB is a state-of-the-art printed circuit board substrate from Rogers, a prominent name in the telecommunications sector. This PCB delivers outstanding performance and reliability, featuring a low dielectric constant ( 2.33 at 10 GHz and 1 MHz), a low dissipation factor (0.0013 at 10 GHz and 0.0009 at 1 MHz), and excellent dimensional stability. It is specifically engineered to meet the rigorous demands of RF and microwave applications.
In terms of Reverse Treated ED Copper, the DiClad 870 laminate offers the following characteristics and advantages:
4.1 Consistency of Surface Roughness:
For various weight specifications (2oz, 1oz, 1/2oz), the dielectric side maintains a consistent surface roughness of 1.0 Sq(μm). This stability ensures reliable bonding between copper foils of different batches and thicknesses during DiClad 870 substrate manufacturing, enhancing product quality.
4.2 Reasonable Change in Upper Surface Roughness:
As copper foil thickness decreases from 2oz to 1oz and then to 1/2oz, the upper surface roughness decreases from 2.0 Sq(μm) to 1.3 Sq(μm) and then to 0.8 Sq(μm). This gradual change meets varying electrical performance requirements, with lower roughness in thinner foils promoting better high-frequency signal transmission and fine-line fabrication.
4.3 Overall Low Roughness:
The roughness values for both the dielectric side and upper surface across specifications are low. This reduces gaps between the copper foil and other materials (e.g., solder mask), improving interlayer bonding and minimizing parasitic capacitance and inductance, thereby enhancing electrical performance. |
