Milled holes improve heat dissipation and reduce signal loss in high-frequency PCBs in the following ways:
3.1 Increased Surface Area
Expanding the area for heat dissipation, improving cooling efficiency.
3.2 Optimized Airflow
Enhancing airflow for better thermal management.
3.3 High Thermal Conductivity
Using thermally conductive materials to boost heat dissipation.
3.4 Lower Dielectric Loss
Minimizing signal reflection and loss through optimized hole size and placement.
3.5 Improved Current Distribution
Providing uniform current flow, reducing localized heating.
3.6 Reduced Parasitic Parameters
Controlling inductance and capacitance to decrease signal delay and loss. |