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Wangling TP High Frequency PCB |
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TP-1/2 is smooth and neat on both sides, no stain, scratch and dent on overall appearance. The chemical etching method used on PCB manufacturing result in stable dielectric properties. The dielectric constant is stable and DK can be optional within the range of 3 to 22 according to the design of circuit requirement. The operating temperature is -100℃～+150℃. |
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The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is designed?to offer customers easy circuit processing, higher pass-rate of production. Especially, the manufacturing cost is much lower than the ceramic substrate. |
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Typical Applications
1.Aircraft Collision Avoidance Systems
2.GPS Antennas
3.Microstrip Patch Antennas
4.Passive Components (filters, couplers, power dividers)
5.Satellite Components |
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Our PCB Capabilities (TP-1/2)
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PCB Material: |
Microwave Composite Dielectric Material |
Designation: |
TP-1/2 |
Dielectric constant: |
10.0 |
Dissipation Factor |
0.001 10GHz |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
0.8mm±0.05, 1.0mm±0.05, 1.2mm±0.05, 1.5mm±0.06, 2.0mm±0.075, 3.0mm±0.1, 4.0mm±0.1, 5.0mm±0.12, 6.0mm±0.12, 10.0mm±0.2 |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
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Data Sheet of TP-1/2 |
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Name |
Test condition |
Unit |
Value |
Density |
Normal state |
g/cm3 |
1.0~2.9 |
Moisture Absorption |
Dip in distilled water of 20±2℃ for 24 hours |
% |
≤0.02 |
Peel strength |
In normal state |
N/cm |
≥6 |
In the environment of alternating humidity and temperature： |
N/cm |
≥4 |
Operating Temperature |
High-low temperature cabinet |
℃ |
-100～+150（Processing temperature should not exceed 200℃） |
Thermal Conductivity |
-55~288℃ |
W /m /k |
0.6 |
CTE |
Temperature rise of 96℃?per hour |
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< 6×10^-5 |
Shrinkage Factor |
2 hours in boiling water |
% |
0.0004 |
Surface Resistivity |
500V DC Normal state |
M.Ω |
≥1×10^7 |
500V DC Constant humidity and temperature |
M.Ω |
≥1×10^5 |
Volume Resistivity |
Normal state |
MΩ.cm |
≥1×10^9 |
Constant humidity and temperature |
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≥1×10^6 |
Surface dielectric strength |
Normal state |
Kv/mm |
≥1.5 |
Constant humidity and temperature |
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≥1.2 |
Dielectric Constant |
10GHz |
εr |
3, 6, 9.6, 10.2, 10.5, 11, 16, 20, 22（±2%）(DK can be customized） |
Dissipation Factor |
10GHz |
Tgδ（εr 3-11） |
≤1×10^-3 |
Tgδ（εr 12-22） |
≤1.5×10^-3 |
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