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Technical Parameters of Al2O3 Ceramic Tiles


Introduction

AL2O3 ceramic tiles are high-performance materials widely used across various fields. This article will provide a comprehensive overview of their technical parameters, including chemical composition, physical properties, mechanical performance, thermal properties, and electrical properties. Additionally, a parameter table for the ceramic circuit boards we used will be included at the end.

 
 
 
    I. Chemical Composition

The primary chemical component of Al2O3 ceramic tiles is aluminum oxide (Al2O3), typically with a content of over 95%. In addition, small amounts of other elements such as yttrium oxide (Y2O3), magnesium oxide (MgO), etc., are also added to enhance the performance of the ceramic tiles.

 

II. Physical Properties

Density: The density of Al2O3 ceramic tiles typically ranges between 3.5-3.9 g/cm³, indicating a high mass and weight.

Hardness: Al2O3 ceramic tiles exhibit very high hardness, usually surpassing 9 on the Mohs scale, comparable to steel, and possessing exceptional wear resistance.

Thermal Conductivity: The thermal conductivity of Al2O3 ceramic tiles is relatively low, typically between 20-30 W/(m·K), demonstrating good thermal insulation properties.

Coefficient of linear Expansion: The coefficient of linear expansion of Al2O3 ceramic tiles is relatively small, usually between 6-8×10^-6/℃, showcasing good thermal stability.

 

III. Mechanical Properties

Strength: The flexural strength of Al2O3 ceramic tiles typically ranges between 300-400 MPa, with compressive strength exceeding 2000 MPa, indicating high mechanical strength.

Fracture Toughness: The fracture toughness of Al2O3 ceramic tiles is relatively low, usually between 3-4 MPa·m1/2, making them prone to brittle fracture.

Hardness: As previously mentioned, Al2O3 ceramic tiles exhibit very high hardness and exceptional wear resistance.

 

IV. Thermal Properties

Heat Resistance: Al2O3 ceramic tiles can maintain stable performance at high temperatures, with a heat resistance temperature exceeding 1500°C.

Thermal Shock Stability:?Al2O3 ceramic tiles exhibit good thermal shock stability, able to withstand significant temperature changes without easily fracturing.

 

V. Electrical Properties

Insulation: Al2O3 ceramic tiles exhibit excellent insulation properties, effectively isolating electric currents and preventing leakage.

Dielectric Constant: The dielectric constant of Al2O3 ceramic tiles is relatively low, typically ranging between 8-10, making them suitable for high-frequency electrical equipment.

Volume Resistivity: Al2O3 ceramic tiles have a high volume resistivity, usually between 10^14-10^16 Ω·cm, demonstrating good insulation performance.

 

VI. Application Areas

Due to the excellent performance of Al2O3 ceramic tiles, they are widely used in electronics, mechanical engineering, chemical industry, medical fields, and more. In the electronics sector, Al2O3 ceramic tiles find applications in manufacturing electronic ceramic substrates, insulators, and other devices. In mechanical engineering, they are utilized for creating bearings, pneumatic seals, and other high-wear components. In the chemical industry, Al2O3 ceramic tiles are employed in fabricating corrosion-resistant equipment like chemical reactors and fillers. In the medical field, Al2O3 ceramic tiles are used for producing artificial joints, dental restorative materials, and more.

 

Conclusion

Al2O3 ceramic tiles exhibit high hardness, excellent wear resistance, good thermal stability, and insulation properties, making them widely applicable across various fields. In future research and applications, further optimization of their performance can be pursued to expand their range of applications.

 

Alumina Oxide Ceramic Copper-Clad?Laminate (DBC-Al2O3 Ceramic)

The DBC (Direct Copper Bonding) process is a method of directly bonding pure copper to ceramics. DBC ceramic copper-clad circuit boards offer a super high cost-performance ratio compared to products using the AMB process, ensuring insulation performance for medium and low power semiconductor applications while providing sufficient thermal conductivity, mechanical properties, and electrical performance.

 
 

 

1.1. Ceramic Substrate (DBC)

 

 

 

 

 

 

 

 

 

 

 

 

项目
Items

单位
Unit

氧化铝
Al2O3

氧化锆
ZTA

 

密度
Density

g/cm3

≥3.75

≥3.95

 

粗糙度
Roughness (Ra)

μm

≤0.6

Ra≤0.6

 

抗弯强度
Bending strength

Mpa

≥400
(3 点法)

≥600
(3 点法)

 

线膨胀系数
Coefficient of thermal
expansion

10-6/K

≤6.9
(40-400℃)

7.5
(40-400℃)

 

热传导率
Thermal conductivity

W/(m*K)

≥24
(25℃)

26
(25℃)

 

介电常数
Dielectric constant

1MHz

9.8

10.2

 

介电损耗
Dielectric loss

1MHz

2*10^-4

2*10^-4

 

体阻抗
Volume resistivity

Ω*cm

>10^14
(25℃)

>10^14
(25℃)

 

绝缘耐压
Dielectric strength

kV/mm

>15

>15

 

1.2.Material thickness

 

 

 

 

 

 

 

 

 

 

 

 

 

 

瓷片
Ceramic thickness

 

 

0.25mm

0.32mm

0.38mm

0.50mm

0.63mm

1.0mm

铜箔
Copper
thickness

0.15mm

ZTA

ZTA

Al2O3

Al2O3

Al2O3

Al2O3

0.2mm

ZTA

ZTA

Al2O3

Al2O3

Al2O3

Al2O3

0.25mm

ZTA

ZTA

Al2O3

Al2O3

Al2O3

Al2O3

0.30mm

ZTA

ZTA

Al2O3

Al2O3

Al2O3

Al2O3

0.40mm

ZTA

ZTA

-

-

-

-

 

 

 

 
 
 
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