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Taconic RF-10 High Frequency PCB |
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Taconic's RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass, which have the advantage of high dielectric constant (10.2 10GHz) and low dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits. |
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RF-10 high frequency materials are engineered to provide a cost effective substrates, responding to a need in RF applications for size reduction. It bonds well to smooth low profile copper too. The low dissipation combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role. |
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Features Benefits
- Excellent adhesion to smooth coppers
- Excellent dimensional stability
- Excellent price/performance ratio
- High thermal conductivity for enhanced thermal management
- High DK for RF circuit size reduction
- Low 0.0025 loss tangent @ 10 GHz
- Low X, Y, Z expansion
- Tight DK tolerance (10.2 +/-0.3)
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Typical Applications
- Aircraft Collision Avoidance Systems
- GPS Antennas
- Microstrip Patch Antennas
- Passive Components (filters, couplers, power dividers)
- Satellite Components
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Our PCB Capabilities (RF-10) |
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PCB Material: |
Composites of Ceramic Filled PTFE and Woven Fiberglass |
Designation: |
RF-10 |
Dielectric constant: |
10.2 |
Dissipation Factor |
0.0025 10GHz |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: |
10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm), 125mil ( 3.175mm ) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
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Data Sheet of Taconic RF-10 |
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Property |
Test Method |
Unit |
Value |
Unit |
Value |
Dk @ 10 GHz |
IPC-650 2.5.5.5.1 Mod. |
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10.2 ± 0.3 |
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10.2 ± 0.3 |
Df @ 10 GHz |
IPC-650 2.5.5.5.1 Mod. |
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0.0025 |
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0.0025 |
TcK† (-55 to 150 °C) |
IPC-650 2.5.5.6 |
ppm/°C |
-370 |
ppm/°C |
-370 |
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.08 |
% |
0.08 |
Peel Strength (1 oz. RT copper) |
IPC-650 2.4.8 (solder) |
lbs/in |
10 |
N/mm |
1.7 |
Volume Resistivity |
IPC-650 2.5.17.1 |
Mohm/cm |
6.0 x 10^7 |
Mohm/cm |
6.0 x 10^7 |
Surface Resistivity |
IPC-650 2.5.17.1 |
Mohm |
1.0 x 10^8 |
Mohm |
1.0 x 10^8 |
Flexural Strength (MD) |
IPC - 650 - 2.4.4 |
psi |
14,000 |
N/mm2 |
96.53 |
Flexural Strength (CD) |
IPC - 650 - 2.4.4 |
psi |
10,000 |
N/mm2 |
68.95 |
Tensile Strength (MD) |
IPC - 650 - 2.4.19 |
psi |
8,900 |
N/mm2 |
62.57 |
Tensile Strength (CD) |
IPC - 650 - 2.4.19 |
psi |
5,300 |
N/mm2 |
37.26 |
Dimensional Stability |
IPC-650 2.4.39 (After Etch) |
% (25 mil-MD) |
-0.0032 |
% (25 mil-CD) |
-0.0239 |
Dimensional Stability |
IPC-650 2.4.39 (After Bake) |
% (25 mil-MD) |
-0.0215 |
% (25 mil-CD) |
-0.0529 |
Dimensional Stability |
IPC-650 2.4.39 (After Stress) |
% (25 mil-MD) |
-0.0301 |
% (25 mil-CD) |
-0.0653 |
Dimensional Stability |
IPC-650 2.4.39 (After Etch) |
% (60 mil-MD) |
-0.0027 |
% (60 mil-CD) |
-0.0142 |
Dimensional Stability |
IPC-650 2.4.39 (After Bake) |
% (60 mil-MD) |
-0.1500 |
% (60 mil-CD) |
-0.0326 |
Dimensional Stability |
IPC-650 2.4.39 (After Stress) |
% (60 mil-MD) |
-0.0167 |
% (60 mil-CD) |
-0.0377 |
Density (Specific Gravity) |
IPC-650-2.3.5 |
g/cm3 |
2.77 |
g/cm3 |
2.77 |
Specific Heat |
IPC-650-2.4.50 |
J/g°C |
0.9 |
J/g°C |
0.9 |
Thermal Conductivity (Unclad) |
IPC-650-2.4.50 |
W/M*K |
0.85 |
W/M*K |
0.85 |
CTE (X -Y axis) (50 to 150 °C) |
IPC-650 2.4.41 |
ppm/°C |
16-20 |
ppm/°C |
16-20 |
CTE (Z axis) (50 to 150 °C) |
IPC-650 2.4.41 |
ppm/°C |
25 |
ppm/°C |
25 |
Flammability Rating |
Internal |
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V-0 |
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V-0 |
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