Taconic TLY-3 PCB 2-layer 0.762mm TLY-3 RF Antenna PCB

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Taconic TLY-3 PCB 2-layer 0.762mm TLY-3 RF Antenna PCB With Immersion Gold for Cellular Communications

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

Taconic TLY laminates belong to the category of low - loss laminates. These laminates are fabricated using extremely lightweight woven fiberglass, which endows them with superior dimensional stability compared to chopped fiber reinforced PTFE composites. The woven matrix structure results in a laminate that is more mechanically robust, making it highly suitable for large - scale production processes.

Thanks to their low dissipation factor, Taconic TLY PCBs are successfully utilized in automotive radar applications operating at 77 GHz, as well as in other antennas designed for millimeter - wave frequencies.

In terms of electrical properties, the dielectric constant of Taconic TLY laminates can reach as low as 2.17 - 2.20 +/- 0.02, while the dissipation factor can be as low as 0.0009.

2-layer Taconic TLY-3 PCB features a construction where a high - quality TLY - 3 substrate, measuring 30mil in thickness, is firmly sandwiched between two solid copper layers. This well - thought - out design offers outstanding signal integrity. By effectively reducing interference, it guarantees that TLY-3 PCB operates at peak performance levels, making it a reliable choice for applications that demand high - quality electrical performance.

Benefits

Dimensionally stable

Lowest DF

Low moisture absorption

High copper peel strength

Uniform & consistent DK

Laser ablatable

Typical applications:

Automotive radar

Satellite/cellular communications

Power amplifiers

LNBs, LNAs, LNCs

Aerospace

Ka, E and W band applications

TLY-3 PCB Specifications

Taconic TLY-3 30mil 0.762mm RF Antenna PCB DK2.33 High Frequency PCB for Satellite / Cellular Communications

PCB SIZE	100 x 90mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 18um(0.5 oz)+plate TOP layer
	TLY-3 0.762mm
	copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.4mm
Number of Different Holes:	1
Number of Drill Holes:	1
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	TLY-3 0.762mm
Final foil external:	1oz
Final foil internal:	N/A
Final height of PCB:	0.8 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold (31%)
Solder Mask Apply To:	NO
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top Side
Colour of Component Legend	white
Manufacturer Name or Logo:	Marked on the board in a conductor and legend FREE AREA
VIA	N/A
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Taconic TLY Material

TLY TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK at 10 GHz	IPC-650 2.5.5.5		2.2		2.2
Df at 10 GHz	IPC-650 2.5.5.5		0.0009		0.0009
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Dielectric Strength	ASTM D 149	V/mil	2,693	V/mil	106,023
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	1010	Mohms/cm	1010
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	1010	Mohms/cm	109
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	108	Mohms	108
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	108	Mohms	108
Flex Strength(MD)	IPC-650 2.4.4	psi	14,057	N/mm²	96.91
Flex Strength(CD)	IPC-650 2.4.4	psi	12,955	N/mm²	89.32
Peel Stength(½ oz.ed copper)	IPC-650 2.4.8	Ibs./inch	11	N/mm	1.96
Peel Stength(1 oz.CL1 copper)	IPC-650 2.4.8	Ibs./inch	16	N/mm	2.86
Peel Stength(1 oz..CV1 copper)	IPC-650 2.4.8	Ibs./inch	17	N/mm	3.04
Peel Stength	IPC-650 2.4.8(after elevated temp.)	Ibs./inch	13	N/mm	2.32
Young's Modulus(MD)	ASTM D 3039/IPC-650 2.4.19	psi	1.4 x 10⁶	N/mm²	9.65 x 10³
Poisson's Ratio(MD)	ASTM D 3039/IPC-650 2.4.19		0.21		0.21
Thermal Conductivity	ASTM F 433	W/M*K	0.22	W/M*K	0.22
Dimensional Stability(MD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.038		-0.038
Dimensional Stability(CD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.031		-0.031
Density(Specific Gravity)	ASTM D 792	g/cm³	2.19	g/cm³	2.19
CTE(X axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	26	ppm/℃	26
CTE(Y axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	15	ppm/℃	15
CTE(Z axis)(25-260℃)	ASTM D 3386(TMA)	ppm/℃	217	ppm/℃	217
NASA Outgassing(% TML)			0.01		0.01
NASA Outgassing(% CVCM)			0.01		0.01
NASA Outgassing(% WVR)			0.00		0.00
UL-94 Flammability Rating	UL-94		V-0		V-0

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