Taconic TLX-8 High Frequency PCB 62mil 1.575mm TLX-8 RF Circuit Board

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Taconic TLX-8 High Frequency PCB 62mil 1.575mm TLX-8 RF Circuit Board with OSP

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

TLX is a dependable option for a variety of RF applications, characterized by its versatility with a dielectric constant (DK) range of 2.45 to 2.65, and available in multiple thicknesses and copper cladding options. It is particularly well-suited for low layer count microwave designs.

As a PTFE-based fiberglass laminate, TLX is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices, and RF components.

This material stands out in the RF microwave substrate market, providing essential mechanical reinforcement in challenging environments. It effectively resists creep in PCBs mounted in housings that experience significant vibrations during space launches, endures high temperatures in engine modules, offers radiation resistance for space applications, supports antennas on warships under extreme sea conditions, and serves as a substrate for altimeters that encounter a wide temperature range during flight.

The TLX family consists of:

TLX-0 (DK 2.45): Dielectric thickness from 0.127 mm to 6.35 mm (5 mil - 250 mil) TLX-9 (DK 2.50): Dielectric thickness from 0.05 mm to 6.35 mm (2 mil - 250 mil) TLX-8 (DK 2.55): Dielectric thickness from 0.064 mm to 6.35 mm (2.5 mil - 250 mil) TLX-7 (DK 2.60): Dielectric thickness from 0.089 mm to 6.35 mm (3.5 mil - 250 mil) TLX-6 (DK 2.65): Dielectric thickness from 0.089 mm to 6.35 mm (3.5 mil - 250 mil)

Benefits:

Excellent mechanical & thermal properties

Low & stable DK

Dimensionally stable

Low moisture absorption

UL 94 V-O rating

Tightly controlled DK

Low DF

For low layer count microwave designs

Applications:

Antennas

Couplers, Splitters, Combiners,

Amplifiers, Mixers, Filters

Passive components

PCB Specifications

Taconic TLX-8 62mil 1.575mm RF Antenna PCB TLT-8 High Frequency PCB for Directional Coupler

PCB SIZE	99 x 88mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 35um(1 oz)+plate TOP layer
	TLX-8 1.575mm
	copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	15 mil / 10 mil
Minimum / Maximum Holes:	0.5mm/2.0mm
Number of Different Holes:	N/A
Number of Drill Holes:	N/A
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	TLX-8 1.575mm
Final foil external:	1 oz
Final foil internal:	N/A
Final height of PCB:	1.6 mm ±10%
PLATING AND COATING
Surface Finish	OSP
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	N/A
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Typical Value of TLX-8

TLX-8 TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK @10 GHz	IPC-650 2.5.5.3		2.55		2.55
Df @1.9 GHz	IPC-650 2.5.5.5.1		0.0012		0.0012
Df @10 GHz	IPC-650 2.5.5.5.1		0.0017		0.0017
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Flexural Strength(MD)	ASTM D 709	psi	28,900	N/mm²
Flexural Strength(CD)	ASTM D 709	psi	20,600	N/mm²
Tensile Strength(MD)	ASTM D 902	psi	35,600	N/mm²
Tensile Strength(CD)	ASTM D 902	psi	27,500	N/mm²
Elongation at Break(MD)	ASTM D 902	%	3.94	%	3.94
Elongation at Break(CD)	ASTM D 902	%	3.92	%	3.92
Young's Modulus(MD)	ASTM D 902	kpsi	980	N/mm²
Young's Modulus(CD)	ASTM D 902	kpsi	1,200	N/mm²
Young's Modulus(MD)	ASTM D 3039	kpsi	1,630	N/mm²
Poisson's Ratio	ASTM D 3039		0.135	N/mm
Peel Stength(1 oz.ed)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	15	N/mm
Peel Stength(1 oz.RTF)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	17	N/mm
Peel Stength(½ oz.ed)	IPC-650 2.4.8.3(Elevated Temp.)	Ibs./linear inch	14	N/mm
Peel Stength(½ oz.ed)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	11	N/mm
Peel Stength(1 oz.rolled)	IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)	Ibs./linear inch	13	N/mm	2.1
Thermal Conductivity	ASTM F433/ASTM 1530-06	W/M*K	0.19	W/M*K	0.19
Dimensional Stability(MD)	IPC-650 2.4.39 Sec.5.5(After Bake.)	mils/in.	0.06	mm/M
Dimensional Stability(CD)	IPC-650 2.4.39 Sec.5.4(After Bake.)	mils/in.	0.08	mm/M
Dimensional Stability(MD)	IPC-650 2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.09	mm/M
Dimensional Stability(CD)	IPC-650 2.4.39 Sec.5.5(Thermal Stress.)	mils/in.	0.1	mm/M
Surface Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)	Mohm	6.605 x 10⁸	Mohm	6.605 x 10⁸
Surface Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)	Mohm	3.550 x 10⁶	Mohm	3.550 x 10⁶
Volume Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)	Mohm/cm	1.110 x 10¹⁰	Mohm/cm	1.110 x 10¹⁰
Volume Resistivity	IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)	Mohm/cm	1.046 x 10¹⁰	Mohm/cm	1.046 x 10¹⁰
CTE(X axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	21	ppm/℃	21
CTE(Y axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	23	ppm/℃	23
CTE(Z axis)(25-260℃)	IPC-650 2.4.41/ASTM D 3386	ppm/℃	215	ppm/℃	215
Density(Specific Gravity)	ASTM D 792	g/cm³	2.25	g/cm³	2.25
T_d(2% Weight Loss)	IPC-650 2.4.24.6(TGA)	℃	535	℃
T_d(5% Weight Loss)	IPC-650 2.4.24.6(TGA)	℃	553	℃
Flammability Rating	UL-94		V-0		V-0

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