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Taconic-TLX-0, TLX-9, TLX-8, TLX-7, and-TLX-6-High-Frequency-PCB-with-HASL, Immersion-Gold, Silver, Tin, and OSP, Advanced-Performance |
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(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.) |
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Hello everyone, Today, let’s dive into the TLX high-frequency PCB series.
The TLX series, developed by Taconic, is a range of PTFE fiberglass laminates designed for reliability across a wide spectrum of RF applications. Known for its versatility, this material features a dielectric constant (DK) range of 2.45 to 2.65, making it ideal for low-layer-count microwave PCBs.
Now, let’s explore the key advantages of TLX:
1. Exceptional Dimensional Stability: Capable of withstanding high levels of vibration, such as those encountered during space launches.
2. Superior Thermal Properties: Designed to endure high-temperature environments, such as those found in engine modules.
3. Low and Stable Dielectric Constant: Offers a tightly controlled DK range of 2.45 to 2.65 with a tolerance of ±0.04.
4. Low Moisture Absorption: Performs reliably in extreme environments, including marine applications.
5. Flame Retardant (UL 94 V0): Meets stringent safety standards for flame resistance.
6. Low Dissipation Factor (DF): Ensures minimal signal loss, making it highly efficient for high-frequency applications. |
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TLX is an ideal material for a variety of applications, thanks to its wide dielectric constant (DK) range, flexible thickness options, and versatile copper cladding. It is particularly well-suited for:
1. Radar systems,
2. Mobile communications,
3. Microwave test equipment,
4. Microwave transmission devices,
Antennas, Mixers, splitters, filters, and combiners. |
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The TLX family includes TLX-0, TLX-9, TLX-8, TLX-7, and TLX-6. These materials are commonly used in single-layer and double-layer boards, with surface finishes typically including bare copper, hot air leveling (HASL), and immersion gold. |
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Our PCB Capability (TLX) |
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PCB Material: |
PTFE Fiberglass |
TLX Family (Dielectric constant ±0.04) |
TLX-0 (DK=2.45) |
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TLX-9 (DK=2.50) |
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TLX-8 (DK=2.55) |
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TLX-7 (DK=2.60) |
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TLX-6 (DK=2.65) |
Layer count: |
1 Layer, 2 Layer, 4 Layer. |
Copper weight: |
0.5oz, 1oz, 2oz |
PCB thickness: |
0.5mm, 0.8mm, 1.0mm, |
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1.5mm, 3.2mm |
PCB Size: |
≤400mm X 500mm |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin etc. |
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The standard colors of TLX high-frequency PCBs are brown and black.
We specialize in offering prototype development, small-batch production, and mass manufacturing services.
If you have any requirements for this type of PCB, please don’t hesitate to reach out to us.
Thank you for your attention! |
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A comparable product features inner layers constructed with half-ounce copper, resulting in a finished PCB thickness of 1.0mm. Below are the detailed stack-up and microsection analysis. |
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Appendix: Data Sheet of TLX-8 |
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TLX-8 TYPICAL VALUES |
Property |
Test Method |
Unit |
Value |
Unit |
Value |
DK @10 GHz |
IPC-650 2.5.5.3 |
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2.55 |
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2.55 |
Df @1.9 GHz |
IPC-650 2.5.5.5.1 |
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0.0012 |
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0.0012 |
Df @10 GHz |
IPC-650 2.5.5.5.1 |
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0.0017 |
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0.0017 |
Dielectric Breakdown |
IPC-650 2.5.6 |
kV |
>45 |
kV |
>45 |
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.02 |
% |
0.02 |
Flexural Strength(MD) |
ASTM D 709 |
psi |
28,900 |
N/mm2 |
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Flexural Strength(CD) |
ASTM D 709 |
psi |
20,600 |
N/mm2 |
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Tensile Strength(MD) |
ASTM D 902 |
psi |
35,600 |
N/mm2 |
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Tensile Strength(CD) |
ASTM D 902 |
psi |
27,500 |
N/mm2 |
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Elongation at Break(MD) |
ASTM D 902 |
% |
3.94 |
% |
3.94 |
Elongation at Break(CD) |
ASTM D 902 |
% |
3.92 |
% |
3.92 |
Young's Modulus(MD) |
ASTM D 902 |
kpsi |
980 |
N/mm2 |
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Young's Modulus(CD) |
ASTM D 902 |
kpsi |
1,200 |
N/mm2 |
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Young's Modulus(MD) |
ASTM D 3039 |
kpsi |
1,630 |
N/mm2 |
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Poisson's Ratio |
ASTM D 3039 |
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0.135 |
N/mm |
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Peel Stength(1 oz.ed) |
IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) |
Ibs./linear inch |
15 |
N/mm |
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Peel Stength(1 oz.RTF) |
IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) |
Ibs./linear inch |
17 |
N/mm |
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Peel Stength(½ oz.ed) |
IPC-650 2.4.8.3(Elevated Temp.) |
Ibs./linear inch |
14 |
N/mm |
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Peel Stength(½ oz.ed) |
IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) |
Ibs./linear inch |
11 |
N/mm |
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Peel Stength(1 oz.rolled) |
IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) |
Ibs./linear inch |
13 |
N/mm |
2.1 |
Thermal Conductivity |
ASTM F433/ASTM 1530-06 |
W/M*K |
0.19 |
W/M*K |
0.19 |
Dimensional Stability(MD) |
IPC-650 2.4.39 Sec.5.5(After Bake.) |
mils/in. |
0.06 |
mm/M |
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Dimensional Stability(CD) |
IPC-650 2.4.39 Sec.5.4(After Bake.) |
mils/in. |
0.08 |
mm/M |
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Dimensional Stability(MD) |
IPC-650 2.4.39 Sec.5.5(Thermal Stress.) |
mils/in. |
0.09 |
mm/M |
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Dimensional Stability(CD) |
IPC-650 2.4.39 Sec.5.5(Thermal Stress.) |
mils/in. |
0.1 |
mm/M |
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Surface Resistivity |
IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) |
Mohm |
6.605 x 108 |
Mohm |
6.605 x 108 |
Surface Resistivity |
IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) |
Mohm |
3.550 x 106 |
Mohm |
3.550 x 106 |
Volume Resistivity |
IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) |
Mohm/cm |
1.110 x 1010 |
Mohm/cm |
1.110 x 1010 |
Volume Resistivity |
IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) |
Mohm/cm |
1.046 x 1010 |
Mohm/cm |
1.046 x 1010 |
CTE(X axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
21 |
ppm/℃ |
21 |
CTE(Y axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
23 |
ppm/℃ |
23 |
CTE(Z axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
215 |
ppm/℃ |
215 |
Density(Specific Gravity) |
ASTM D 792 |
g/cm3 |
2.25 |
g/cm3 |
2.25 |
Td(2% Weight Loss) |
IPC-650 2.4.24.6(TGA) |
℃ |
535 |
℃ |
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Td(5% Weight Loss) |
IPC-650 2.4.24.6(TGA) |
℃ |
553 |
℃ |
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Flammability Rating |
UL-94 |
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V-0 |
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V-0 |
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