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TLY-5Z High Frequency PCB |
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Taconic's TLY-5Z high frequency laminates are advanced composites of ceramic, PTFE and woven fiberglass reinforcement. It is designed for low density applications such as aerospace having optimally low weight requirements. Since using ceramic and woven fiberglass, TLY-5Z has high stable property on dimension. The low density approach also makes it with a low Z axis expansion which is not possible with PTFE-rich composites. TLY-5Z has high thermally stability and it has just half the thermal expansion of PTFE-rich laminates, offers improved drilling and can be thermally cycled. |
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Benefits:
Low Z Axis CTE
Plated through hole stability
Low density (1.92 g/cm3)
Attractive price/performance ratio
Excellent peel strength
Compatible with flat copper |
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Typical Applications:
Aerospace components
Low weight antennas for aircraft
RF passive component
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Our PCB Capability (TLY-5Z)
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| PCB Material: |
Composites of Ceramic, PTFE and Woven Fiberglass |
| Designation: |
TLY-5Z |
| Dielectric constant: |
2.20 +/- 0.04 (1.9GHz) |
| Dissipation Factor |
0.0015 (10GHz) |
| Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: |
0.5oz (17 μm), 1oz (35μm) |
| Laminate thickness: |
10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm? ) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
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Appendix: Typical Values of TLY-5Z |
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| Property |
Test Method |
Unit |
Value |
Unit |
Value |
| Dk @ 1.9 GHz |
IPC-650 2.5.5.5.1 Mod. |
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2.20+/- 0.04 |
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2.20+/- 0.04 |
| Df @ 1.9 GHz |
IPC-650 2.5.5.5.1 Mod. |
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0.001 |
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0.001 |
| Df @ 10 GHz |
IPC-650 2.5.5.5.1 Mod. |
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0.0015 |
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0.0015 |
| Tc(D)K (-55 ~150°C) |
IPC-650 2.5.5.6 Mod. |
ppm/°C |
-72 |
ppm/°C |
-72 |
| Dielectric Breakdown Voltage |
IPC-650 2.5.6 |
kV |
45 |
kV |
45 |
| Dielectric Strength |
IPC-650 2.5.6.2 |
V/mil |
770 |
V/mm |
30,315 |
| Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.03 |
% |
0.03 |
| Peel Strength (1 oz. copper) |
IPC-650 2.4.8 |
lbs./inch |
7 |
N/mm |
1.3 |
| Volume Resistivity |
IPC-650 2.5.17.1 |
Mohms/cm |
10^9 |
Mohms/cm |
10^9 |
| Surface Resistivity |
IPC-650 2.5.17.1 |
Mohms |
10^8 |
Mohms |
10^8 |
| Tensile Strength (MD) |
IPC-650 2.4.18.3 |
psi |
9137 |
N/mm2 |
63 |
| Tensile Strength (CD) |
IPC-650 2.4.18.3 |
psi |
9572 |
N/mm2 |
66 |
| Tensile Modulus (MD) |
IPC-650 2.4.18.3 |
psi |
182,748 |
N/mm2 |
1260 |
| Tensile Modulus (CD) |
IPC-650 2.4.18.3 |
psi |
165,344 |
N/mm2 |
1140 |
| Elongation (MD) |
IPC-650 2.4.18.3 |
% |
6 |
% |
6 |
| Elongation (CD) |
IPC-650 2.4.18.3 |
% |
6.9 |
% |
6.9 |
| Flex Strength (MD) |
ASTM D790 |
psi |
10,300 |
N/mm2 |
71 |
| Flex Strength (CD) |
ASTM D790 |
psi |
11,600 |
N/mm2 |
80 |
| Flex Modulus (MD) |
ASTM D790 |
psi |
377,100 |
N/mm2 |
2600 |
| Flex Modulus (CD) |
ASTM D790 |
psi |
432,213 |
N/mm2 |
2980 |
| Dimensional Stability (MD) |
IPC-650 2.4.39 (Bake) |
% (10 mil) |
-0.05 |
% (30 mil) |
-0.05 |
| Dimensional Stability (CD) |
IPC-650 2.4.39 (Bake) |
% (10 mil) |
-0.17 |
% (30 mil) |
-0.11 |
| Dimensional Stability (MD) |
IPC-650 2.4.39 (Stress) |
% (10 mil) |
-0.07 |
% (30 mil) |
-0.07 |
| Dimensional Stability (CD) |
IPC-650 2.4.39 (Stress) |
% (10 mil) |
-0.22 |
% (30 mil) |
-0.14 |
| Density (Specific Gravity) |
IPC-650 2.3.5 |
g/cm3 |
1.92 |
g/cm3 |
1.92 |
| Specific Heat |
IPC-650 2.4.50 |
J/g°C |
0.95 |
J/g°C |
0.95 |
| Thermal Conductivity |
IPC-650 2.4.50 |
W/M*K |
0.2 |
W/M*K |
0.2 |
| CTE (x-y) (50 - 150°C) |
IPC-650 2.4.41 |
ppm/oC |
30-40 |
ppm/oC |
30-40 |
| CTE (z) (50 - 150°C) |
IPC-650 2.4.41 |
ppm/oC |
130 |
ppm/oC |
130 |
| Hardness |
ASTM D2240 (Durometer) |
- |
68 |
- |
68 |
| UL-94 Flammability Rating |
UL-94 |
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V-0 |
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V-0 |
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