The dielectric layer of the Polytetrafluoroethylene ceramic composite dielectric substrate TFA series consists of PTFE resin and ceramics, and is not produced using the traditional method of impregnating glass fiber cloth with resin to make prefabricated sheets. Instead, a new process is employed to create prefabricated sheets, which are then pressed using a special lamination process. This material exhibits outstanding electrical, thermal, and mechanical properties with excellent dielectric constant at the same level, making it an aerospace-grade high-frequency and high-reliability material that can replace similar foreign products.
This series of substrates does not contain glass fiber cloth. It utilizes a large amount of uniform special nano-ceramics mixed with resin, eliminating the fiberglass effect during the propagation of electromagnetic waves. It offers excellent frequency stability, with minimal dielectric loss at the same level. The material's X/Y/Z anisotropy is minimized, and it also features a low thermal expansion coefficient equivalent to copper foil and stable dielectric temperature characteristics.
The dielectric constant of this series includes four options: 2.94, 3.0, 6.15, and 10.2 for selection. The corresponding part numbers are TFA294, TFA300, TFA615, TFA1020.
The TFA series comes standard with RTF low roughness copper foil, reducing conductor loss while providing excellent peel strength. It can also be paired with rolled copper foil, and the TFA series can be matched with copper-based or aluminum-based materials.
TFA294 and TFA300 can be paired with buried 50Ω resistance copper foil to form a resistance film laminate.
The circuit boards can be processed using standard PTFE board processing technology, exhibiting excellent mechanical and physical properties suitable for multi-layer, high-layer, and backplane processing. They also demonstrate excellent processability in dense hole and fine line processing.
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