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SCGA-500 GF265 High Frequency PCB |
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SCGA-500 GF265 from Shengyi Technology Co., Ltd (SYTECH) is low loss PTFE woven glass UL 94 V-0 high frequency circuit material. It has been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms. |
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Its controlled dielectric constant provides excellent electrical and mechanical properties with a consistent and stable DK (2.55Dk +/- 0.04) and dissipation factor (0.0014) over a wide range of frequencies (1GHz to 20 GHz) and Temperatures (-40 °C to +125 °C). |
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It exhibits exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils). |
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SCGA-500F GF265 is an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance. |
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Features
- Consistent and Stable Dk/Df over Frequency and Temperature
- Low Dielectric Loss Tangent
- Excellent Price Performance Value
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Typical applications
- Base Station Antennas
- Power Amplifiers
- Satellite Communications
- DAS and CPE Antenna
- Automotive Radar and Wireless Communications.
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PCB Capability(SCGA-500 GF265) |
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PCB Material: |
PTFE Woven Glass |
Designation: |
SCGA-500 GF265 |
Dielectric constant: |
2.65? (10 GHz) |
Dissipation factor |
0.0017 (10 GHz) |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
1oz (35μm), 2oz (70μm) |
Dielectric thickness |
10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm),? 40mil (1.016mm), 50mil (1.270mm), 60mil (1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Immersion gold ( ENIG), HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc.. |
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