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Rogers TMM3 High Frequency PCB |
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Rogers' TMM3 high frequency laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability stripline and microstrip applications. It has the dielectric constant of 3.27 and dissipation factor of 0.002. |
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TMM3 has an exceptionally low thermal coefficient of dielectric constant. Its isotropic coefficients of thermal expansion is very closely matched to copper which results in production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM3 is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal. |
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Since TMM3 is based on thermoset resins, and do not soften when heated. So wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation. |
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Typical Applications
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our PCB Capabilities (TMM3) |
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PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM3 |
Dielectric constant: |
3.27 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 μm), 1oz (35μm), 2oz (70μm) |
Laminate thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
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Typical Value of TMM3 |
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Property |
TMM3 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.27±0.032 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
3.45 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.002 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
+37 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
2 x 109 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
>9x 10^9 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
441 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
15 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
15 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
23 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.7 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
16.53 |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.72 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.06 |
- |
% |
D/24/23 |
ASTM D570 |
3.18mm (0.125") |
0.12 |
Specific Gravity |
1.78 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.87 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
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