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Rogers RO4730G3 High Frequency PCB |
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Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc |
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RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.
Typical application is cellular base station antennas. |
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Our PCB Capabilities (RO4730G3) |
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PCB Material: |
Hydrocarbon ceramic woven glass |
Designator: |
RO4730G3 |
Dielectric constant: |
3.0 ±0.05 (process) |
2.98 (design) |
Layer count: |
1 Layer, 2 Layer, Multilayer |
Copper weight: |
0.5oz (17 μm), 1oz (35μm) |
Laminate thickness(low profile copper): |
5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm) |
Laminate thickness(ED Copper) |
20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion silver, OSP,etc. |
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Data Sheet of Taconic RO4730G3 |
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Property |
RO4730G3 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.0±0.5 |
Z |
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10 GHz 23℃ |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
2.98 |
Z |
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1.7 GHz to 5 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0028 |
Z |
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10 GHz 23℃ |
IPC-TM-650 2.5.5.5 |
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2.5 GHz |
Thermal Coefficient of ε |
+34 |
Z |
ppm/℃ |
-50 ℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
<0.4 |
X, Y |
mm/m |
after etech +E2/150 ℃ |
IPC-TM-650 2.4.39A |
Volume Resistivity (0.030") |
9 X 107 |
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MΩ.cm |
COND A |
IPC-TM-650? 2.5.17.1 |
Surface Resistivity (0.030") |
7.2 X 105 |
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MΩ |
COND A |
IPC-TM-650? 2.5.17.1 |
PIM |
-165 |
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dBc |
50 ohm 0.060" |
43 dBm 1900 MHz |
Electrical Strength (0.030") |
730 |
Z |
V/mil |
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IPC-TM-650? 2.5.6.2 |
Flexural Strength MD |
181 (26.3) |
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Mpa (kpsi) |
RT |
ASTM D790 |
CMD |
139 (20.2) |
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Moisure Absorption |
0.093 |
- |
% |
48/50 |
IPC-TM-650 2.6.2.1 ASTM D570 |
Thermal Conductivity |
0.45 |
Z |
W/mK |
50℃ |
ASTM D5470 |
Coefficient of Thermal Expansion |
15.9
14.4
35.2 |
X
Y
Z |
ppm/℃ |
-50 ℃to 288℃ |
IPC-TM-650 2.4.4.1 |
Tg |
>280 |
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℃ |
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IPC-TM-650 2.4.24 |
Td |
411 |
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℃ |
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ASTM D3850 |
Density |
1.58 |
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gm/cm3 |
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ASTM D792 |
Copper Peel Stength |
4.1 |
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pli |
1oz,LoPro EDC |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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