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Rogers Kappa 438 High Frequency PCB |
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Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible. |
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Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed |
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Features
1. Glass reinforced hydrocarbon thermoset platform
2. Dk of 4.38 is tailored to FR-4 industry standard norms
3. Tighter Dk and thickness tolerance than FR-4
4. Low Z Axis CTE of 42 ppm/°C
5. High Tg of > 280°C TMA
6. Meets UL 94-V0 requirements |
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Benefits
1. Ease of PCB manufacturing and assembly in Line with FR-4
2. Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
3. Consistent circuit performance
4. Improved design flexibility and plated through-hole reliability
5. Automated assembly compatible |
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Typical Applications:
1. Carrier Grade WiFi/Licensed Assisted Access (LAA)
2. Small Cell and Distributed Antenna Systems (DAS)
3. Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
4. Internet of Things (IoT), Segments: Smart Home and Wireless Meters
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Our PCB Capabilities (Kappa 438) |
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| PCB Material: |
Glass Reinforced Hydrocarbon Ceramic |
| Designation: |
Kappa 438 |
| Dielectric constant: |
4.38 |
| Layer count: |
Double Layer, Multilayer, Hybrid PCB |
| Copper weight: |
0.5oz (17 μm), 1oz (35μm) |
| PCB thickness: |
20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion Gold, Immersion Silver etc.. |
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| Property |
Typical Value Kappa 438 |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant, er Design |
4.38 |
Z |
- |
2.5 GHz |
Differential Phase Length Method |
| Dissipation Factor tan, |
0.005 |
Z |
- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constante |
-21 |
- |
ppm/°C |
10 GHz (-50 to 150°C)
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Modified IPC-TM-650 2.5.5.5 |
| Volume Resistivity |
2.9 x 109 |
- |
M??cm |
COND A |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
6.2 x 107 |
- |
M? |
COND A |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
675 |
Z |
V/mil |
- |
IPC-TM-650 2.5.6.2 |
| Tensile Strength |
16?? 12 |
MD CMD |
kpsi |
- |
ASTM D3039/D3039-14 |
| Flexural Strength |
25? 19 |
MD CMD |
kpsi |
- |
IPC-TM-650 2.4.4 |
| Dimensional Stability |
?-0.48-0.59 |
MD CMD |
mm/m |
- |
IPC-TM-650 2.4.39a |
| Coefficient of Thermal Expansion |
13 |
X |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.4.41 |
| 16 |
Y |
| 42 |
Z |
| Thermal Conductivity |
0.64 |
Z |
W/(m.K) |
80°C |
ASTM D5470 |
| Time to Delamination (T288) |
>60 |
- |
minutes |
288°C |
IPC-TM-650 2.4.24.1 |
| Tg |
>280 |
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°C TMA |
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IPC-TM-650 2.4.24.3 |
| Td |
414 |
- |
°C |
- |
IPC-TM-650 2.3.40 |
| Moisture Absorption |
0.07 |
- |
% |
24/23 |
IPC-TM-650 2.6.2.1 |
| Young’s Modulus |
2264 2098 |
MD CMD |
kpsi |
- |
ASTM D3039/D3039-14 |
| Flex Modulus |
2337 2123 |
MD CMD |
kpsi |
- |
IPC-TM-650 2.4.4 |
| Bow |
0.03 |
- |
% |
- |
IPC-TM-650 2.4.22C |
| Twist |
0.08 |
- |
% |
- |
IPC-TM-650 2.4.22C |
Copper Peel Strength After Thermal Stress
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5.8 |
- |
lbs/in |
1 oz (35 μm) foil |
IPC-TM-650 2.4.8 |
| Flammability |
V-0 |
- |
- |
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UL 94 |
| Specific Gravity |
1.99 |
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g/cm3 |
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ASTM D792 |
| Lead-Free Process Compatible |
Yes |
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