The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, and micro-dispersed ceramic filler that are intended to increase loss tangent while preserving good dimensional stability and offering excellent thermal reliability and electrical performance.

The majority of final finishes, including HASL, Sn, Ag, Ni/Au, OSP, etc., have been applied to CLTE-XT materials without incident or cause for concern. Individual circuit board can be routed, punched, or laser cut depending on preference, tolerances, and edge quality requirements.

Features and Benefits

• Copper matched CTE in X and Y axis
• Low Z-direction CTE of 20 ppm /°C
• Low dissipation factor of 0.0010 at 10 GHz reduced circuit losses without sacrificing dimensional stability
• Tightest dielectric constant tolerance(+/- .03) and DK stability with temperature change
• High reliability on plated through holes
• 0.02% low moisture absorption
• Great number of NASA outgassing values.
• High thermal conductivity of 0.56 W/m/K

Typical Applications
1. Advanced Driver Assistance Systems (ADAS)
2. CNI (communication, navigation and identification) Applications
3. Defense Microwave/RF Applications
4. Microwave Feed Networks
5. Phased Array Antennas
6. Power Amplifiers
7. Patch Antennas
8. Radar Manifolds
9. Satellite & Space Electronics

Our PCB Capability (CLTE-XT laminates)