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Rogers AD1000 High Frequency PCB |
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Brief Introduction
AD1000 is a high dielectric constant (10.2 or greater) high frequency material, ?a woven glass reinforced laminate. It permits circuit miniaturization, compared to traditional low loss materials and allows for greater dimensional stability and mechanical robustness than other 10 Dk laminates. AD1000 Laminates are considered a soft material which can bear vibrational stress, do not need special complicated processing or handling during the fabrication process, comparing with pure ceramic materials. |
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Features:
1. Woven glass reinforced PTFE/Ceramic with high Dk of 10.2
2. Thermal conductivity of 0.81 W/mK
3. High copper peel strength allows for thinner etched line widths
4. Lowest insertion loss
5. Larger panel sizes available
6. Low moisture absorption of 0.03%
7. Highly reliability ceramic component attachment and PTH reliability resulting from excellent CTE values |
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Typical Applications:
1. Aircraft Collision Avoidance Systems (TCAS)
2. Ground Based Radar Surveillance Systems
3. Low Noise Amplifiers (LNAs)
4. Miniaturized Circuitry & Patch Antennas
5. Power Amplifiers (PAs)
6. Radar Modules and Manifolds
7. X-Band and Below |
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Our PCB Capabilities (AD1000)
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PCB Material: |
Woven Glass Reinforced PTFE/Ceramic Filled |
Designation: |
AD1000 |
Dielectric constant: |
10.2 |
Dissipation Factor |
0.0023 10GHz |
Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: |
6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm), 125mil ( 3.175mm ), 127mil (3.226mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
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Typical Value of AD1000 |
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Property |
Units |
Value |
Test Method |
1. Electrical Properties |
Dielectric Constant (may vary by thickness) |
@1 MHz |
- |
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IPC TM-650 2.5.5.3 |
@ 10 GHz |
- |
10.2 |
IPC TM-650 2.5.5.5 |
Dissipation Factor |
@ 1 MHz |
- |
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IPC TM-650 2.5.5.3 |
@ 10 GHz |
- |
0.0023 |
IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric |
- |
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TCεr @ 10 GHz (-40-150°C) |
ppm/℃ |
-380 |
IPC TM-650 2.5.5.5 |
Volume Resistivity |
C96/35/90 |
MΩ-cm |
1.40x109 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ-cm |
5.36x107 |
IPC TM-650 2.5.17.1 |
Surface Resistivity |
C96/35/90 |
MΩ |
1.80x109 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ |
3.16x108 |
IPC TM-650 2.5.17.1 |
Electrical Strength |
Volts/mil (kV/mm) |
622 (24.5) |
IPC TM-650 2.5.6.2 |
Dielectric Breakdown |
kV |
>45 |
IPC TM-650 2.5.6 |
Arc Resistance |
sec |
>180 |
IPC TM-650 2.5.1 |
2. Thermal Properties |
Decomposition Temperature (Td) |
Initial |
℃ |
>500 |
IPC TM-650 2.4.24.6 |
5% |
℃ |
>500 |
IPC TM-650 2.4.24.6 |
T260 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T288 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T300 |
min |
>60 |
IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC |
ppm/℃ |
8, 10 |
IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC |
ppm/℃ |
20 |
IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) |
% |
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IPC TM-650 2.4.24 |
3. Mechanical Properties |
Peel Strength to Copper (1 oz/35 micron) |
After Thermal Stress |
lb/in (N/mm) |
>12 (2.1) |
IPC TM-650 2.4.8 |
At Elevated Temperatures (150º) |
lb/in (N/mm) |
13.6 (2.4) |
IPC TM-650 2.4.8.2 |
After Process Solutions |
lb/in (N/mm) |
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IPC TM-650 2.4.8 |
Young’s Modulus |
kpsi (GPa) |
200 (1.38) |
IPC TM-650 2.4.18.3 |
Flexural Strength (Machine/Cross) |
kpsi (MPa) |
9.9/7.5 (68/52) |
IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) |
kpsi (MPa) |
5.1/4.3 (35/30) |
IPC TM-650 2.4.18.3 |
Compressive Modulus |
kpsi (GPa) |
>425 (>2.93) |
ASTM D-3410 |
Poisson’s Ratio |
- |
0.16 |
ASTM D-3039 |
4. Physical Properties |
Water Absorption |
% |
0.03 |
IPC TM-650 2.6.2.1 |
Density, ambient 23ºC |
g/cm3 |
3.20 |
ASTM D792 Method A |
Thermal Conductivity |
W/mK |
0.81 |
ASTM E1461 |
Flammability |
class |
Meets V0 |
UL-94 |
NASA Outgassing, 125ºC, ≤10-6 torr |
% |
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NASA SP-R-0022A |
Total Mass Loss |
% |
0.01 |
NASA SP-R-0022A |
Collected Volatiles |
% |
0.00 |
NASA SP-R-0022A |
Water Vapor Recovered |
% |
0.00 |
NASA SP-R-0022A |
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