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Rogers-TMM6-Microwave-Printed-Circuit-Board-20mil-50mil-75mil-DK6.0-RF-PCB-With-Immersion-Gold |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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General Description |
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Rogers TMM6 thermoset microwave laminates are a composite blend of ceramic, hydrocarbon, and thermoset polymers, meticulously engineered for stripline and microstrip applications where high reliability of plated - through - holes (PTH) is crucial. Sporting a dielectric constant of 6.0 and a dissipation factor of 0.0023, TMM6 PCB stands out in the realm of microwave materials.
One of the remarkable features of Rogers TMM6 laminate is its extremely low thermal coefficient of dielectric constant. This, combined with the fact that its isotropic coefficients of thermal expansion closely mirror those of copper, enables the creation of highly reliable plated through holes. Additionally, it exhibits low etch shrinkage values, which is beneficial for maintaining the integrity of the circuit patterns during the manufacturing process. What's more, the thermal conductivity of TMM6 substrate is around double that of traditional PTFE/ceramic laminates. This enhanced thermal conductivity significantly aids in dissipating heat, a vital aspect in applications where temperature management can impact performance.
Rogers TMM6 PCB is formulated from thermoset resins, endowing it with the unique property of not softening upon heating. This characteristic proves invaluable as it allows for wire bonding of component leads to circuit traces without the risk of pad lifting or substrate deformation. Such reliability in the manufacturing process makes TMM6 PCB an ideal choice for a wide range of high - performance electronic applications. |
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Typical Applications |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our PCB Capability(TMM6) |
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PCB Capability (TMM6) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM6 |
Dielectric constant: |
6 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated, ENEPIG etc.. |
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Why Choose Us? |
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1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3 |
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Typical Value of TMM6 |
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TMM6 Typical Value |
Property |
TMM6 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
6.0±0.08 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
6.3 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.0023 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
-11 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
2 x 10^8 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
1 x 10^9 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
362 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
18 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
18 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
26 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.72 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
15.02 |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.75 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.06 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.2 |
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Specific Gravity |
2.37 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.78 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
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Hot Tags:
Rogers TMM6 PCB Board |
TMM6 Printed Circuit Board |
TMM6 Microwave Rogers PCB |
TMM6 RF Rogers PCB |
TMM6 20mil 50mil 75mil PCB |
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