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Rogers TMM13i High Frequency PCB 60mil 1.524mm High DK 12.85 RF PCB With Immersion Gold |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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General Description |
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This double-sided Rogers TMM13i PCB is fabricated on TMM13i substrate (60mil thickness), featuring immersion gold (ENIG) finish on pads and a copper weight transition from ½ oz to 1 oz. Rogers TMM13i PCB (top side ) includes a green solder mask, and all boards are produced to IPC Class 2 standards with 100% electrical testing prior to shipment. Units are vacuum-sealed in packs of 25 for secure delivery. |
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PCB Specifications |
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PCB SIZE |
100 x 100mm=1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5 oz)+plate TOP layer |
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TMM13i 1.524mm |
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copper ------- 17um(0.5 oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
4 mil / 5 mil |
Minimum / Maximum Holes: |
0.35 mm / 2.0 mm |
Number of Different Holes: |
8 |
Number of Drill Holes: |
1525 |
Number of Milled Slots: |
3 |
Number of Internal Cutouts: |
no |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
TMM13i 1.524mm |
Final foil external: |
1.0 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.6mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion gold, 67% |
Solder Mask Apply To: |
Top Layer |
Solder Mask Color: |
Green |
Solder Mask Type: |
LPI |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Component Side |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Kuangshun |
VIA |
Plated through hole(PTH), minimum size 0.35mm. |
FLAMIBILITY RATING |
94V-0 |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Typical Applications |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our PCB Capability(TMM13i) |
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PCB Capability (TMM13i) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM13i |
Dielectric constant: |
12.85±0.35 |
Layer count: |
Single Layer,Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, ENEPIG, Pure gold etc.. |
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Data Sheet of TMM13i |
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TMM13i Typical Value |
Property |
TMM13i |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
12.85±0.35 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
12.2 |
- |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.0019 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
-70 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
- |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
- |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
213 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
19 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
19 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
- |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
4.0 (0.7) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
- |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
- |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.16 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.13 |
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Specific Gravity |
3 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
- |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
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Hot Tags:
TMM 13i Printed Circuit Board |
TMM Series PCB Material |
TMM 13i 60mil PCB |
Rogers TMM 13i Laminate |
TMM 13i Immersion Gold PCB |
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