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Rogers-TMM10i-Microwave-Printed-Circuit-Board-15mil-25mil-50mil-75mil-TMM10i-RF-PCB-with-Immersion-Gold |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers’ TMM10i thermoset microwave materials, being ceramic, hydrocarbon, and thermoset polymer composites, are engineered for high-reliability stripline and microstrip applications with plated-thru-holes.
In terms of electrical and mechanical features, TMM10i laminates combine numerous advantages of ceramic and traditional PTFE microwave circuit laminates. Notably, it doesn't call for the specialized production techniques typical of these materials.
TMM10i PCBs have an extremely low thermal coefficient of dielectric constant, usually not exceeding 30 ppm/°C. Their isotropic coefficients of thermal expansion, which are well-matched with copper, enable the production of high-reliability plated through holes and low etch shrinkage. Furthermore, the thermal conductivity of TMM10i laminates is about twice that of traditional PTFE/ceramic laminates, which helps in heat dissipation.
As Rogers TMM10i PCBs are made from thermoset resins and don't soften upon heating, wire bonding of component leads to circuit traces can be carried out without the worry of pad lifting or substrate deformation. |
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Typical applications: |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our Capabilities (TMM10i PCB) |
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PCB Capability (TMM10i) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM10i |
Dielectric constant: |
9.80 ±0.245 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
HASL, ENIG, Immersion tin, Immersion silver, OSP, Pure Gold, ENEPIG, Bare copper etc.. |
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Data Sheet of TMM10i PCB |
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TMM10i Typical Value |
Property |
TMM10i |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
9.80±0.245 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
9.9 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.002 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
-43 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
2 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
4 x 107 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
267 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
19 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
19 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.76 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.0 (0.9) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
- |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.8 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.16 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.13 |
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Specific Gravity |
2.77 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.72 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
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Hot Tags:
TMM10i Datasheet |
TMM10i Substrate |
TMM10i High Frequency PCB |
15mil TMM10i PCB |
TMM10i Rogers PCB |
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