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Rogers-TMM10-PCB-50mil-1.27mm-Thermoset-Microwave-Materials-with-Immersion-Gold-for-GPS-Antennas |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers TMM10 thermoset microwave PCBs are composite materials consisting of ceramic, hydrocarbon, and thermoset polymers. They are designed for stripline and microstrip applications where high reliability of plated-thru-holes is essential. TMM10 laminates possess electrical and mechanical properties that combine the merits of ceramic and traditional PTFE microwave circuit laminates. Importantly, it doesn't rely on the specialized production methods commonly used for these materials.
These laminates exhibit an incredibly low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The isotropic thermal expansion coefficients of TMM10 PCBs , which closely resemble those of copper, allow for the manufacturing of highly reliable plated through holes and low etch shrinkage. Additionally, the thermal conductivity of TMM10 laminates is approximately twofold that of traditional PTFE/ceramic laminates, which is beneficial for heat removal.
Since Rogers TMM10 PCBs are formed from thermoset resins and maintain their shape when heated, wire bonding of component leads to circuit traces can be done without concerns about pad lifting or substrate warping. |
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Typical applications: |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our Capabilities (TMM10 PCB) |
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PCB Capability (TMM10) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM10 |
Dielectric constant: |
9.20 ±0.23 |
Layer count: |
Single Layer, Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Pure Gold, OSP etc.. |
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Data Sheet of TMM10 PCB |
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TMM10 Typical Value |
Property |
TMM10 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
9.20±0.23 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
9.8 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.0022 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
-38 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
2 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
4 x 107 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
285 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
21 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
21 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.76 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.0 (0.9) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
13.62 |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.79 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.09 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.2 |
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Specific Gravity |
2.77 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.74 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
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Hot Tags:
TMM10 Datasheet |
TMM10 Rogers PCB |
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Rogers TMM10 PCB |
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