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Rogers-TMM10-30mil-0.762mm-Radio-Frequency-PCBs-with-Immersion-Gold-for-Filters-and-Couplers |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers TMM10 thermoset microwave PCBs, which are ceramic, hydrocarbon, and thermoset polymer composites, are tailored for high plated-thru-hole reliability in stripline and microstrip applications.
The electrical and mechanical properties of TMM10 laminates integrate many of the advantages of ceramic and traditional PTFE microwave circuit laminates. Significantly, it bypasses the need for the specialized production techniques typical of these materials.
With an extremely low thermal coefficient of dielectric constant, usually below 30 ppm/°C, TMM10 laminates stand out. Their isotropic coefficients of thermal expansion, which are highly compatible with copper, make it possible to produce high-quality plated through holes TMM10 PCBs with low etch shrinkage. What's more, the thermal conductivity of TMM10 laminates is around twice that of traditional PTFE/ceramic laminates, facilitating better heat dissipation.
As Rogers TMM10 PCBs are composed of thermoset resins and don't soften when exposed to heat, wire bonding of component leads to circuit traces can be executed without the risk of pad lifting or substrate deformation. |
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Typical applications: |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our Capabilities (TMM10 PCB) |
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PCB Capability (TMM10) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM10 |
Dielectric constant: |
9.20 ±0.23 |
Layer count: |
Single Layer, Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Pure Gold, OSP etc.. |
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Data Sheet of TMM10 PCB |
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TMM10 Typical Value |
Property |
TMM10 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
9.20±0.23 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
9.8 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.0022 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
-38 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
2 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
4 x 107 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
285 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
21 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
21 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.76 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.0 (0.9) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
13.62 |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.79 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.09 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.2 |
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Specific Gravity |
2.77 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.74 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
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- |
- |
- |
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Hot Tags:
Rogers TMM10 Datasheet |
30mil TMM10 Substrate |
TMM10 High Frequency PCB |
Rogers TMM10 PCB |
TMM10 RF PCB |
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