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Rogers-TMM10-25mil-0.635mm-Microwave-PCBs-Chemical-Gold-and-Green-Solder-Mask-for-Dielectric-Polarizers-and-Lenses |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers TMM10 thermoset microwave PCBs are a type of ceramic, hydrocarbon, and thermoset polymer composite. They are specifically designed for stripline and microstrip applications where high plated-thru-hole reliability is crucial.
In terms of electrical and mechanical characteristics, TMM10 laminates bring together the benefits of both ceramic and traditional PTFE microwave circuit laminates. The best part is that it doesn't need the special production methods often required for these materials.
Rogers TMM10 PCBs have an extraordinarily low thermal coefficient of dielectric constant, generally less than 30 ppm/°C. The isotropic thermal expansion coefficients of this material are very close to those of copper. This similarity allows for the creation of high-reliability plated through holes and results in low etch shrinkage. Moreover, the thermal conductivity of TMM10 laminates is about two times that of traditional PTFE/ceramic laminates, making heat removal more efficient.
Being based on thermoset resins, TMM10 PCBs remain stable when heated. So, when wire bonding component leads to circuit traces, there's no fear of pad lifting or substrate distortion. |
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Typical applications: |
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1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems |
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Our Capabilities (TMM10 PCB) |
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PCB Capability (TMM10) |
PCB Material: |
Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: |
TMM10 |
Dielectric constant: |
9.20 ±0.23 |
Layer count: |
Single Layer, Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
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PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, Pure Gold, OSP etc.. |
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Data Sheet of TMM10 PCB |
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TMM10 Typical Value |
Property |
TMM10 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
9.20±0.23 |
Z |
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10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
9.8 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.0022 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
-38 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
2 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
4 x 107 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
285 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - x |
21 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
21 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
20 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.76 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.0 (0.9) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
13.62 |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.79 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.09 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.2 |
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Specific Gravity |
2.77 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.74 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
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Hot Tags:
TMM10 Microwave PCB |
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